XC3S200A-4FT256I

The XC3S200A-4FT256I is a Spartan®-3A Field Programmable Gate Array (FPGA) IC offering a mid-range balance of logic capacity, on-chip memory, and I/O density in a compact 256-LBGA package. Engineered for industrial-grade use, it provides a configurable hardware platform suitable for designs that require moderate logic resources, substantial embedded memory, and a high count of I/O signals.

Key Features

• Logic Capacity  4,032 logic elements organized across 448 logic blocks, delivering the programmable resources needed for medium-density digital designs.
• Embedded Memory  Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for buffering, state storage, and small data structures.
• I/O and Gate Count  195 user I/Os and 200,000 equivalent gates to support complex interfacing and integration of multiple peripherals.
• Power  Core voltage supply range from 1.14 V to 1.26 V to match system power rails and enable consistent device operation.
• Package and Mounting  Surface-mount 256-LBGA package; supplier device package listed as 256-FTBGA (17×17) for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet the thermal demands of industrial environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Industrial-grade temperature range and abundant I/O make this FPGA suitable for sensor interfacing, control logic, and machine automation tasks.
• Embedded Systems  Mid-range logic capacity and on-chip RAM support custom peripheral integration, finite state machines, and glue-logic for embedded platforms.
• Communications and Networking  High I/O count and substantial gate resources enable protocol handling and interfacing between multiple serial and parallel buses.

Unique Advantages

• Balanced Programmable Resources: 4,032 logic elements and 294,912 bits of embedded RAM provide a practical mix of logic and memory for medium-complexity designs.
• High I/O Density: 195 I/Os allow flexible connectivity for multi-signal interfaces and parallel peripheral support, reducing external glue logic.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, offering robust performance in demanding environmental conditions.
• Compact Surface-Mount Package: The 256-LBGA (256-FTBGA, 17×17) package supports board-space constrained designs while maintaining extensive pin availability.
• Low-Voltage Core: Core supply from 1.14 V to 1.26 V simplifies power-supply planning for modern systems.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose XC3S200A-4FT256I?

The XC3S200A-4FT256I positions itself as a practical, industrial-grade FPGA for designers needing a balanced combination of logic, embedded memory, and a high number of I/Os in a compact package. Its operating temperature range and surface-mount 256-LBGA packaging suit long-life or environmentally demanding projects where board space and reliability matter.

For engineering teams developing mid-complexity digital systems—such as industrial controllers, embedded platforms, or communication interfaces—this device offers predictable resources and straightforward integration, helping to control BOM complexity while maintaining design flexibility.

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