XC3S200A-4FG320I

The XC3S200A-4FG320I is a Spartan®-3A Field Programmable Gate Array (FPGA) in a 320-BGA package. It provides 448 CLBs delivering 4,032 logic elements, approximately 0.295 Mbits of embedded memory, and 248 user I/O for programmable digital logic integration.

Specified as industrial grade with an operating temperature range of -40 °C to 100 °C and a core voltage supply of 1.14–1.26 V, this device is intended for designs that require moderate-density reprogrammable logic in a compact surface-mount BGA package.

Key Features

• Programmable Logic (CLBs) — 448 CLBs providing 4,032 logic elements and a design capacity of 200,000 gates for mid-range logic implementation.
• Embedded Memory — Approximately 294,912 bits (~0.295 Mbits) of on-chip RAM for local data storage and buffering.
• High I/O Count — 248 user I/O pins to support multiple external interfaces and signal connections.
• Package & Mounting — 320-BGA (supplier device package: 320-FBGA, 19×19) in a surface-mount form factor for compact PCB layouts.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device logic.
• Temperature & Grade — Industrial grade device rated for operation from -40 °C to 100 °C; RoHS compliant.

Unique Advantages

• Balanced logic and memory: Combines 4,032 logic elements with approximately 0.295 Mbits of embedded memory to support mid-range programmable functions without external RAM for some designs.
• Extensive I/O capability: 248 I/O pins provide flexibility for interfacing multiple peripherals, sensors, and subsystems.
• Industrial temperature rating: Operates from -40 °C to 100 °C and is designated industrial grade for use in environments requiring extended temperature performance.
• Compact BGA footprint: 320-FBGA (19×19) package enables high-density board integration while supporting surface-mount assembly processes.
• Low-voltage core: 1.14–1.26 V supply range for core logic operation, matching contemporary low-voltage design requirements.
• RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing and assembly.

Why Choose XC3S200A-4FG320I?

The XC3S200A-4FG320I delivers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 320-BGA surface-mount package. Its industrial-grade temperature range and RoHS compliance make it suitable for applications that require reliable operation across extended ambient conditions.

This device is well suited for design teams seeking a moderate-density, reprogrammable logic solution with on-chip memory and plentiful I/O in a compact form factor. The specified voltage range, package, and operating temperature provide a clear basis for system-level integration and long-term deployment.

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