XC3S200A-4FGG320C

The XC3S200A-4FGG320C is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD designed as a surface-mount integrated circuit in a 320-BGA package. It delivers 4,032 logic elements across 448 configurable logic blocks (CLBs), with on-chip memory and extensive I/O to support compact, programmable digital designs.

This commercial-grade FPGA offers a core voltage window of 1.14 V to 1.26 V, an operating temperature range of 0 °C to 85 °C, and RoHS compliance, making it suitable for standard commercial electronic applications that require moderate logic capacity and high I/O density.

Key Features

• Logic Capacity  4,032 logic elements implemented across 448 CLBs, providing programmable logic resources for custom digital functions.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 total bits) to support buffering, state storage, and small embedded data structures.
• I/O Density  248 user I/O pins enable broad external device interfacing and high-connectivity system designs.
• Gate Count  Approximately 200,000 gates for mid-range integration of combinational and sequential logic.
• Power  Specified supply range of 1.14 V to 1.26 V to match system power delivery requirements.
• Package & Mounting  320-BGA package (supplier device package: 320-FBGA, 19×19) in a surface-mount form factor for compact board layouts.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting environmentally conscious design and manufacturing.

Unique Advantages

• Balanced Logic and Memory: Combines 4,032 logic elements with approximately 0.295 Mbits of embedded RAM for designs that require both control logic and local data storage.
• High I/O Count: 248 I/O pins provide flexibility for connecting to multiple peripherals, sensors, and interface standards without external multiplexing.
• Compact Ball Grid Array Package: The 320-BGA (320-FBGA, 19×19) enables a small PCB footprint while retaining high pin density for complex routing.
• Clear Power Envelope: A defined supply range of 1.14 V to 1.26 V simplifies power supply design and verification.
• Commercial Availability and Compliance: Commercial grade temperature specification and RoHS compliance support mainstream product development and production.

Why Choose XC3S200A-4FGG320C?

The XC3S200A-4FGG320C positions itself as a mid-range Spartan®-3A FPGA option for designers who need a balanced combination of logic resources, on-chip memory, and high I/O density in a compact surface-mount package. Its 4,032 logic elements, substantial I/O count, and approximately 0.295 Mbits of embedded RAM make it suitable for a variety of programmable digital designs where space-efficient integration and RoHS compliance are important.

Engineers and procurement teams seeking a commercially graded FPGA with a clearly defined power and temperature envelope will find the XC3S200A-4FGG320C a practical choice for scalable, reliable implementations that leverage AMD’s Spartan®-3A architecture.

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