XC3S2000-5FGG456C

The XC3S2000-5FGG456C is a Spartan®-3 field programmable gate array (FPGA) from AMD designed for commercial electronic applications. It combines a mid-range logic fabric with on-chip memory and a high I/O count to support a variety of programmable logic tasks.

This device provides 5,120 CLBs (46,080 logic elements), approximately 0.74 Mbits of embedded memory (737,280 bits), and 333 I/O, packaged in a 456-ball BGA and specified for operation from 0 °C to 85 °C with a 1.14 V to 1.26 V supply.

Key Features

• Core Logic 5,120 CLBs delivering 46,080 logic elements and approximately 2,000,000 gates for programmable digital logic implementation.
• Embedded Memory Approximately 0.74 Mbits of on-chip RAM (737,280 bits) to support buffering, LUT storage and user memory needs.
• I/O Capacity 333 I/O pins to accommodate multi‑signal interfacing and peripheral connectivity in compact systems.
• Power Supply Operates from a 1.14 V to 1.26 V supply range to match system power requirements.
• Package and Mounting 456-ball BGA package case with surface-mount construction; supplier device package also listed as 456-FBGA (23×23).
• Operating Range Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant for lead-free manufacturing processes.

Unique Advantages

• High logic density: 46,080 logic elements and 5,120 CLBs provide substantial programmable resources for complex logic designs without external ASICs.
• Significant on-chip memory: Approximately 0.74 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Generous I/O count: 333 I/O pins enable broad peripheral and bus connectivity in a single device footprint.
• Compact BGA package: 456-ball BGA in a surface-mount form factor supports high-density board layouts and automated assembly.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with typical commercial electronic product requirements.
• Regulatory readiness: RoHS compliance facilitates integration into lead‑free product shipments and supply chains.

Why Choose XC3S2000-5FGG456C?

The XC3S2000-5FGG456C delivers a balanced combination of logic resources, embedded memory, and I/O in a single commercial‑grade FPGA package. Its specification set—46,080 logic elements, approximately 0.74 Mbits of on‑chip RAM, 333 I/O, and a 456-ball BGA—makes it suitable for engineers and procurement teams seeking a programmable solution that fits mid-range logic and memory requirements while supporting compact board designs.

Backed by AMD manufacturing and RoHS compliance, this device is appropriate for a range of commercial electronic designs where programmable flexibility, integration, and standard commercial thermal operation are required.

Request a quote or submit an inquiry referencing part number XC3S2000-5FGG456C to begin the procurement process or for assistance with availability and pricing.