XC3S2000-4FGG676I

The XC3S2000-4FGG676I is a Spartan®-3 field programmable gate array (FPGA) device offering substantial programmable logic, on-chip memory, and a high I/O count in a compact BGA package. Its architecture delivers a balance of logic capacity and embedded RAM for designs that require configurable digital processing and dense I/O integration.

Designed and manufactured by AMD, this industrial-grade FPGA is suited to applications that demand robust operating temperature range and a compact surface-mount package while providing a significant number of logic elements and gates for custom logic implementation.

Key Features

• Core Logic 5,120 CLBs and 46,080 logic elements provide substantial programmable logic resources for implementing complex digital designs.
• Embedded Memory Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) to support buffers, FIFOs, and local data storage.
• I/O and Gate Count 489 user I/O pins and an equivalent of 2,000,000 gates enable high-density interfacing and sizeable logic implementations.
• Power Supply Core voltage range of 1.14 V to 1.26 V for the programmable core supply.
• Package and Mounting 676-ball BGA package (supplier package: 676-FBGA, 27×27) in a surface-mount configuration to minimize board footprint.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Regulatory Status RoHS compliant.

Typical Applications

• Industrial Control Implement real-time control logic and custom signal processing within industrial equipment using the device’s industrial temperature rating and programmable logic resources.
• Embedded Systems Integrate configurable digital functions and local memory for embedded applications requiring flexible hardware acceleration and moderate on-chip RAM.
• High-Density I/O Interfaces Support complex sensor arrays, peripheral aggregation, or custom I/O subsystems with 489 available I/O pins.
• Prototyping and Custom Logic Use the FPGA’s sizable logic element count and gate equivalence to prototype or deploy custom digital architectures.

Unique Advantages

• Large Logic Capacity: 46,080 logic elements and 5,120 CLBs let designers implement substantial custom logic without immediate need for larger devices.
• Meaningful On-Chip Memory: Approximately 0.74 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary storage tasks.
• High I/O Count: 489 I/O pins enable integration of multiple interfaces and peripherals directly on the FPGA.
• Compact, Surface-Mount Package: 676-BGA (676-FBGA, 27×27) minimizes board area while supporting a high pin count for dense designs.
• Industrial Robustness: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments while meeting environmental requirements.

Why Choose XC3S2000-4FGG676I?

The XC3S2000-4FGG676I offers a combination of extensive programmable logic, embedded memory, and a high I/O count in a compact BGA package rated for industrial temperatures. This balance of resources makes it suitable for engineers who need configurable hardware capacity, moderate on-chip RAM, and dense interfacing in temperature-critical applications.

For teams focused on scalable, board-level designs that require a programmable solution with verified industrial operating range and RoHS compliance, this Spartan®-3 FPGA provides a practical option with clear, verifiable specifications to match design requirements.

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