XC3S2000-4FGG456C

The XC3S2000-4FGG456C is an AMD Spartan®-3 Field Programmable Gate Array (FPGA) offered in a 456-ball BGA package. It delivers substantial on-chip resources for board-level programmable logic, including 46,080 logic elements, 737,280 total RAM bits and a 333-pin I/O count.

Designed as a commercial-grade FPGA, the device operates from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C temperature range. Its combination of logic capacity, embedded memory and high I/O density makes it suitable for a wide range of programmable-logic implementations that require surface-mount packaging.

Key Features

• Core Capacity 46,080 logic elements and approximately 2,000,000 gates provide a substantial fabric for implementing complex combinational and sequential logic.
• Embedded Memory 737,280 total RAM bits available on-chip to support data buffering, lookup tables and on-device state storage.
• I/O Resources 333 I/O pins for high-density external interfacing and flexible board-level connectivity.
• Power Operates from a 1.14 V to 1.26 V supply range, enabling consistent core power requirements across designs.
• Package & Mounting 456-ball BGA package (456-FBGA, 23×23) in a surface-mount form factor suited to compact PCB layouts.
• Operating Range & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant, supporting lead-free design and manufacturing processes.

Typical Applications

• Custom Logic Prototyping — Use the 46,080 logic elements to prototype and validate complex digital functions on a single device.
• Embedded System Control — On-chip RAM and extensive I/O enable control and interface logic for embedded controllers and subsystem management.
• I/O-Intensive Interfaces — 333 I/Os provide capacity for bridging, protocol conversion and multi-channel data routing at the board level.
• FPGA-Based Acceleration — Combine large logic capacity and embedded memory to offload and accelerate deterministic processing tasks in system designs.

Unique Advantages

• High Logic Density: 46,080 logic elements deliver the capacity to implement sizable logic networks without partitioning across multiple devices.
• Substantial On‑Chip Memory: 737,280 RAM bits allow for sizable lookup tables, FIFOs and buffering close to logic, reducing external memory dependency.
• Extensive I/O Count: 333 I/Os simplify board routing for multi-channel or multi-protocol designs and reduce the need for external I/O expanders.
• Compact Surface-Mount Package: 456-ball BGA in a 23×23 format supports dense PCB layouts while maintaining robust mounting and signal integrity.
• Commercial-Grade Operation: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic product designs.

Why Choose XC3S2000-4FGG456C?

The XC3S2000-4FGG456C positions itself as a high-capacity Spartan®-3 FPGA option from AMD for engineers needing extensive logic, embedded memory and I/O in a single commercial-grade package. Its balance of logic elements, on-chip RAM and 333 I/Os supports complex programmable designs while simplifying board-level integration with a 456-ball surface-mount BGA.

This device is well suited for designers building medium- to high-density programmable logic solutions who require predictable operating voltages (1.14 V–1.26 V), RoHS compliance and a commercial temperature rating. As part of the Spartan-3 family, it provides a well-defined resource set for time-to-market driven projects that benefit from a single-chip programmable approach.

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