XC3S2000-4FG676I

The XC3S2000-4FG676I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD in a 676-ball BGA package. It delivers 46,080 logic elements, approximately 0.737 Mbits of embedded memory, and 489 I/Os, providing a programmable foundation for custom digital designs.

Specified for industrial use and RoHS compliant, this device supports a core voltage range of 1.14 V to 1.26 V and operates across an extended temperature range of −40 °C to 100 °C, making it suitable for applications that require robust operation in demanding environments.

Key Features

• Core Capacity  46,080 logic elements enable complex, custom digital implementations and parallel processing architectures.
• Embedded Memory  Approximately 0.737 Mbits of on-chip RAM support buffering, FIFOs, and local data storage for high-throughput designs.
• I/O Density  489 user I/Os provide extensive external connectivity for high-pin-count interfaces and dense system integration.
• Logic Scale  2,000,000 gates of logic resource to implement sizable logic functions and system controllers.
• Package & Mounting  676-BGA (supplier package: 676-FBGA, 27×27) in a surface-mount form factor for compact, board-level integration.
• Power  Core supply range of 1.14 V to 1.26 V for consistent operation within specified voltage limits.
• Temperature & Grade  Industrial grade device rated for −40 °C to 100 °C, suitable for temperature-challenging deployments.
• Compliance  RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• Industrial Automation  Industrial-grade specification and extended temperature range support programmable control, I/O aggregation, and system interfacing in factory and process environments.
• Communications Equipment  High logic capacity and dense I/O count enable protocol implementation, packet processing, and custom interfacing in network and telecom modules.
• Prototyping & Development  Substantial logic and embedded memory resources make this FPGA suitable for hardware prototyping and iterative design validation.

Unique Advantages

• High logic integration: 46,080 logic elements and 2,000,000 gates provide the capacity to consolidate multiple functions into a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 0.737 Mbits of embedded RAM support local data buffering and reduce dependence on external memory.
• Extensive I/O availability: 489 I/Os allow flexible interfacing with sensors, peripherals, and high-pin-count connectors without additional I/O expanders.
• Industrial reliability: Rated for −40 °C to 100 °C and labeled industrial grade for deployment in temperature-challenging systems.
• Compact, surface-mount BGA: 676-ball FBGA (27×27) package enables dense board layouts and is suitable for space-constrained designs.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and assembly requirements.

Why Choose XC3S2000-4FG676I?

The XC3S2000-4FG676I positions itself as a robust, industrial-grade FPGA option that balances substantial logic and memory resources with a high I/O count and a compact BGA footprint. Its specified voltage and temperature ranges make it a practical choice for designers needing dependable programmable logic in demanding environments.

This device is well suited to engineering teams building industrial control systems, communications equipment, or hardware prototypes that require on-chip memory, dense I/O, and sizable logic capacity. The combination of integration, industrial rating, and RoHS compliance delivers long-term value for systems with rigorous environmental and regulatory expectations.

Request a quote or submit a pricing inquiry to evaluate the XC3S2000-4FG676I for your next design project.