XC3S2000-4FGG456I

The XC3S2000-4FGG456I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded logic applications. It provides a combination of high logic capacity, on-chip memory, and a large I/O count to support complex digital designs within a 456-ball BGA package.

With 46,080 logic elements, approximately 0.737 Mbits of embedded memory, and up to 333 I/O pins, this device is intended for industrial applications that require substantial programmable logic, flexible interfacing, and reliable operation across a broad temperature range.

Key Features

• Core Logic  46,080 logic elements (logic cells) and approximately 2,000,000 gates provide the programmable fabric for implementing complex digital functions.
• Embedded Memory  Approximately 0.737 Mbits of on-chip RAM for data buffering, FIFOs, and lookup tables.
• I/O Capacity  Up to 333 I/O pins allow extensive external connectivity and flexible interfacing with peripherals and external devices.
• Power  Operates with a supply voltage range from 1.14 V to 1.26 V to match system power rails and design constraints.
• Package and Mounting  Available in a 456-ball BGA package (456-BBGA) with supplier device package listed as 456-FBGA (23×23); designed for surface-mount assembly.
• Environmental and Reliability  Industrial-grade device with an operating temperature range of -40 °C to 100 °C and RoHS compliance for environmental considerations.

Typical Applications

• Industrial Control Systems  Implement control logic, state machines, and interface bridging in industrial automation equipment where industrial temperature range and reliability are required.
• Embedded Processing and Custom Logic  Host custom digital processing, protocol handling, and peripheral integration using the device’s large logic capacity and on-chip RAM.
• High‑I/O Interfacing  Provide extensive external connectivity for sensor arrays, actuator networks, or multi-channel data routing with up to 333 I/O pins.

Unique Advantages

• High Logic Capacity: 46,080 logic elements enable implementation of sizable digital designs without external ASICs or discrete logic.
• Meaningful On‑Chip Memory: Approximately 0.737 Mbits of embedded RAM supports buffering, temporary storage, and data manipulation on device.
• Extensive I/O Count: 333 I/O pins support complex interfacing needs and simplify board-level connectivity.
• Industrial Temperature Range: Specified operation from -40 °C to 100 °C supports deployment in industrial environments.
• Compact BGA Packaging: 456-ball BGA (456-FBGA, 23×23) enables a compact PCB footprint while accommodating high pin count.
• RoHS Compliant: Meets current lead-free and material compliance requirements for regulated assemblies.

Why Choose XC3S2000-4FGG456I?

The XC3S2000-4FGG456I positions itself as a robust industrial-grade FPGA option for designs that need substantial programmable logic, on-chip RAM, and a high number of I/O pins in a compact BGA package. Its specified supply voltage range and broad operating temperature range make it suitable for reliable operation in demanding environments.

This device is appropriate for engineers and procurement teams developing industrial control, embedded processing, or high‑I/O interfacing solutions who require a balance of integration, predictable electrical requirements, and environmental compliance for long-term product deployments.

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