XC3S2000-4FG676C

The XC3S2000-4FG676C is a Spartan®-3 field programmable gate array (FPGA) offered in a 676-ball BGA package. It provides a balance of on-chip logic resources, embedded memory, and a high I/O count for programmable digital designs in commercial applications.

This device is suited to designs that require significant programmable logic capacity and extensive external connectivity while maintaining a compact surface-mount footprint and standard commercial temperature operation.

Key Features

• Core logic  5,120 configurable logic blocks (CLBs) delivering 46,080 logic elements for implementing complex custom logic and state machines.
• Embedded memory  737,280 total RAM bits (approximately 0.74 Mbits) for buffering, FIFOs, and on-chip data storage.
• I/O and gate capacity  489 user I/Os and an internal equivalent of 2,000,000 gates to support broad connectivity and logic integration.
• Power and supply  Specified operating supply range of 1.14 V to 1.26 V to match system power rails and design requirements.
• Package and mounting  676-ball BGA (supplier package: 676-FBGA, 27 × 27) in a surface-mount form factor to minimize board area.
• Temperature and grade  Commercial grade operation from 0 °C to 85 °C for mainstream electronics applications.
• Regulatory  RoHS compliant for environmentally conscious manufacturing.

Typical Applications

• Embedded control and glue logic  Implement custom control paths, peripheral interfaces, and system glue logic using the device's dense logic resources and plentiful I/Os.
• Prototyping and development  Use the programmable fabric and on-chip memory for rapid iteration of digital designs and proof-of-concept implementations.
• High-density I/O routing  Leverage 489 I/Os for protocol bridging, parallel data interfaces, and multiplexed connections between subsystems.
• Data buffering and on-chip storage  Take advantage of the embedded RAM for temporary data storage, FIFOs, and simple packet buffering in communication paths.

Unique Advantages

• Substantial logic capacity: 46,080 logic elements enable integration of complex finite-state machines, control logic, and combinational functions on a single device.
• Significant embedded memory: Approximately 0.74 Mbits of on-chip RAM reduce dependency on external memory for buffering and small data stores.
• Very high I/O count: 489 user I/Os simplify board-level routing and connection to multiple peripherals and subsystems without multiplexing compromises.
• Compact BGA packaging: 676-ball FBGA (27 × 27) provides high pin density in a surface-mount package to save PCB area in space-constrained designs.
• Commercial-grade fit: 0 °C to 85 °C operating range and RoHS compliance align the device with mainstream electronic product requirements.

Why Choose XC3S2000-4FG676C?

The XC3S2000-4FG676C combines substantial programmable logic, embedded memory, and a very high I/O count in a compact 676-BGA package, making it a practical choice for commercial designs that need on-board customization and extensive connectivity. Its supply voltage range and commercial temperature rating suit a wide range of standard electronic products.

Designers looking to consolidate discrete logic, implement complex interface bridging, or prototype FPGA-based systems will find this device provides a balanced mix of integration and flexibility while remaining compliant with RoHS requirements.

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