XC3S2000-5FGG676C

The XC3S2000-5FGG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) manufactured by AMD. It provides a programmable logic foundation with a combination of logic resources, embedded memory, and a high I/O count in a compact BGA package.

This device is suitable for designers needing substantial on-chip logic capacity and I/O density within a commercial-grade temperature range and surface-mount package.

Key Features

• Logic Capacity  Approximately 46,080 logic elements, offering substantial programmable logic for complex digital designs.
• Programmable Logic Blocks  5,120 LABs/CLBs equivalent grouping to structure logic implementation across the device.
• Embedded Memory  Approximately 0.74 Mbits of on-chip RAM (737,280 total RAM bits) for data buffering, state storage, and small memory structures.
• I/O Density  489 user I/O pins to support wide parallel interfaces and multiple external connections without extensive multiplexing.
• Gate Count  Approximately 2,000,000 gates of equivalent logic capacity to map large designs.
• Package & Mounting  676-ball BGA package (676-FBGA, 27 × 27 mm) with surface-mount mounting type for compact board integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental  RoHS compliant.

Unique Advantages

• High logic density: 46,080 logic elements enable implementation of complex state machines, datapaths, and custom accelerators.
• Significant on-chip RAM: Approximately 0.74 Mbits of embedded memory reduces external memory dependence for mid-sized buffering and storage tasks.
• Extensive I/O capability: 489 I/O pins simplify connection to peripherals, sensors, and parallel interfaces, lowering the need for external multiplexing logic.
• Compact BGA footprint: 676-ball, 27 × 27 mm FBGA package supports dense PCB layouts while providing robust signal routing.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose XC3S2000-5FGG676C?

The XC3S2000-5FGG676C provides a balance of programmable logic, embedded memory, and a high I/O count in a single commercial-grade FPGA package from AMD. Its combination of approximately 46,080 logic elements, substantial on-chip RAM, and nearly 500 I/Os makes it suitable for designs that require integrated logic and interface density in a compact surface-mount BGA form factor.

This device is well suited to engineering teams and procurement groups seeking a commercially graded FPGA from a recognized manufacturer, offering the on-chip resources and package characteristics needed for medium-complexity digital designs and system integration tasks.

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