XC3S200A-4FT256C

IC FPGA 195 I/O 256FTBGA
Part Description

Spartan®-3A Field Programmable Gate Array (FPGA) IC 195 294912 4032 256-LBGA

Quantity 1,873 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs448Number of Logic Elements/Cells4032
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XC3S200A-4FT256C – Spartan®-3A FPGA, 256-LBGA

The XC3S200A-4FT256C is a Spartan®-3A Field Programmable Gate Array (FPGA) in a 256-LBGA package designed for commercial electronic designs. It provides 4,032 logic elements, approximately 0.295 Mbits of embedded RAM, and 195 user I/O pins, delivering a balance of programmable logic, on-chip memory, and I/O density for mid-range FPGA applications.

This surface-mount device operates from a 1.14 V to 1.26 V core supply and is specified for 0 °C to 85 °C commercial temperature operation. The device is RoHS compliant and packaged in a 256-FTBGA (17×17) supplier package.

Key Features

  • Core Logic 4,032 logic elements and an internal equivalent of approximately 200,000 gates provide flexible programmable logic capacity for custom digital functions.
  • Embedded Memory Approximately 0.295 Mbits of on-chip RAM to support data buffering, state storage, and small lookup tables without external memory.
  • High I/O Count 195 user I/O pins accommodate a variety of peripheral interfaces and system signals.
  • Power Core voltage range of 1.14 V to 1.26 V for targeted low-voltage FPGA designs.
  • Package and Mounting 256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount format for compact board integration.
  • Operational Grade and Environment Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Unique Advantages

  • Balanced Logic and Memory: 4,032 logic elements combined with approximately 0.295 Mbits of embedded RAM enable integration of control, data path, and buffering functions on a single device, reducing external component needs.
  • High I/O Density: 195 I/O pins simplify connections to sensors, peripherals, and external interfaces, helping streamline board-level routing and design.
  • Compact BGA Packaging: The 256-LBGA (256-FTBGA, 17×17) package delivers a space-efficient footprint for compact PCB layouts while supporting surface-mount assembly.
  • Low-Voltage Core: A defined 1.14 V to 1.26 V supply range supports power-aware designs and facilitates predictable power budgeting.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operation for designs targeting commercial-environment applications.
  • RoHS Compliant: Conforms to RoHS requirements for lead-free manufacturing practices.

Why Choose XC3S200A-4FT256C?

The XC3S200A-4FT256C positions itself as a compact, mid-range Spartan®-3A FPGA offering a practical combination of logic density, embedded RAM, and I/O resources in a 256-LBGA surface-mount package. Its clear electrical and thermal specifications—1.14 V to 1.26 V core voltage and 0 °C to 85 °C operating range—make it suitable for commercial designs that require deterministic on-chip resources and a space-efficient footprint.

Designers and procurement teams seeking a RoHS-compliant, commercially graded FPGA with roughly 4,032 logic elements, ~0.295 Mbits of embedded memory, and 195 I/Os will find this device a straightforward option for integrating programmable logic, reducing external components, and simplifying board-level integration.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC3S200A-4FT256C.

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