XC3S200A-4VQG100C

The XC3S200A-4VQG100C is a Spartan®-3A field programmable gate array (FPGA) supplied in a 100-TQFP surface-mount package. It provides a balance of programmable logic, on-chip memory, and I/O density for configurable digital designs.

With 4,032 logic elements and approximately 294,912 bits of embedded RAM, this commercial-grade device is intended for designs that require moderate logic capacity, integrated memory, and flexible interfacing at a supply voltage range of 1.14 V to 1.26 V.

Key Features

• Core Logic  Approximately 4,032 logic elements (corresponding to 200,000 gates) to implement combinational and sequential logic functions.
• Embedded Memory  Approximately 294,912 bits of on-chip RAM for data buffering, small FIFOs, and local storage.
• I/O Capability  68 general-purpose I/O pins to support multiple external interfaces and peripherals.
• Power  Operates from a core supply voltage in the range of 1.14 V to 1.26 V for core power planning.
• Package & Mounting  100-TQFP (supplier package: 100-VQFP, 14 × 14 mm) in a surface-mount form factor for compact PCB layouts.
• Operating Conditions  Commercial temperature rating with an operating range of 0 °C to 85 °C.
• RoHS Compliance  Device is RoHS compliant for lead-free assembly processes.

Typical Applications

• Custom digital logic  Implement glue logic, finite state machines, and protocol translators using the device’s 4,032 logic elements and 200,000-gate complexity.
• On-chip buffering and small memories  Use approximately 294,912 bits of embedded RAM for data buffering, FIFOs, and temporary storage close to processing logic.
• Peripheral and interface control  Drive and monitor external peripherals or buses with 68 I/O pins for flexible interfacing.
• Board-level prototyping  Surface-mount 100-TQFP package supports compact PCB implementations for proof-of-concept and system integration.

Unique Advantages

• Moderate logic density: Approximately 4,032 logic elements enable implementation of medium-complexity designs without external discrete logic.
• Integrated on-chip RAM: Nearly 295 kbits of embedded memory reduces the need for external RAM for local buffering and small storage tasks.
• Compact package: 100-TQFP (14 × 14 mm) surface-mount footprint helps minimize board area while maintaining accessible I/O.
• Defined power envelope: Narrow core supply range (1.14 V–1.26 V) simplifies power supply design and decoupling strategy.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for applications targeting commercial environments.
• RoHS compliant: Conforms to lead-free manufacturing requirements for modern assembly processes.

Why Choose XC3S200A-4VQG100C?

The XC3S200A-4VQG100C positions itself as a compact, commercial-grade FPGA suitable for designs needing moderate programmable logic, on-chip memory, and flexible I/O in a 100-TQFP surface-mount package. Its combination of approximately 4,032 logic elements, roughly 294,912 bits of embedded RAM, and 68 I/O pins provides a balanced platform for implementing control logic, interface glue, and small buffering tasks.

This device is appropriate for engineering teams and procurement seeking a RoHS-compliant, commercially rated FPGA with a well-defined power and thermal envelope. Its package and specification set make it a pragmatic choice for board-level integration where moderate logic capacity and on-chip memory are required.

Request a quote or submit an inquiry for pricing and availability of the XC3S200A-4VQG100C to initiate your procurement or evaluation process.