XC3S200A-5FGG320C

The XC3S200A-5FGG320C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD, offered in a 320-BGA surface-mount package. This commercial-grade FPGA delivers a balanced combination of programmable logic, on-chip memory and I/O capacity for a wide range of embedded and system-level designs.

Key device attributes include 4,032 logic elements, approximately 0.295 Mbits of embedded RAM (294,912 bits), 248 user I/O pins, and approximately 200,000 gates, with a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 4,032 logic elements providing approximately 200,000 gates of programmable logic for implementing custom digital functions.
• Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to support data buffering, state storage and local memory needs.
• I/O Resources — 248 user I/O pins to interface with peripherals, buses and external devices.
• Package & Mounting — 320-BGA package; supplier device package listed as 320-FBGA (19×19) in a surface-mount form factor for compact board integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system rails.
• Temperature & Compliance — Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.

Unique Advantages

• Consolidated programmable logic and memory: Combines 4,032 logic elements with embedded RAM to implement complex logic and local storage without extensive external components.
• Generous I/O count: 248 user I/Os simplify system interfacing and flexible signal routing on densely populated boards.
• Compact BGA footprint: 320-BGA (320-FBGA, 19×19) surface-mount package supports high-density PCB layouts while maintaining substantial logic capacity.
• Low-voltage core compatibility: 1.14 V to 1.26 V supply range aligns with low-voltage digital system architectures.
• Commercial-grade suitability: Rated 0 °C to 85 °C and RoHS compliant for mainstream commercial applications.

Why Choose XC3S200A-5FGG320C?

The XC3S200A-5FGG320C offers a practical balance of logic density, on-chip memory and I/O availability in a compact BGA package, making it suitable for commercial embedded designs that require programmable logic and integration. Its defined supply and temperature ranges support predictable deployment in commercial environments.

Manufactured by AMD, this Spartan‑3A FPGA variant provides a known device profile for teams seeking a programmable solution with clear, verifiable specifications for capacity, I/O and packaging.

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