XC3S200AN-4FT256I

The XC3S200AN-4FT256I is a Spartan®-3AN field programmable gate array (FPGA) in a 256-LBGA package. It provides 4,032 logic elements, approximately 0.295 Mbits of embedded memory (294,912 bits), and 195 user I/Os in a surface-mount 256‑FTBGA (17×17) package.

Built and specified for industrial use, this device supports low-voltage operation and wide operating temperature range to meet demanding embedded system requirements where programmable logic, on-chip memory, and a high I/O count are required.

Key Features

• Core Logic  4,032 logic elements supporting complex programmable logic implementations; gate equivalent specification of 200,000 gates.
• Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for buffering, state machines, and small data stores.
• I/O Capacity  195 user I/Os to interface with peripherals, sensors, and other system components.
• Power  Operates from a core supply range of 1.14 V to 1.26 V for low-voltage system designs.
• Package and Mounting  Surface-mount 256-LBGA implementation (supplier package: 256‑FTBGA, 17×17) for compact board integration.
• Industrial Temperature Range  Specified for operation from −40 °C to 100 °C to support industrial environments.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems  Implement custom control logic and interface aggregation using the device’s 4,032 logic elements and 195 I/Os in industrial environments.
• Embedded Processing and Glue Logic  Use embedded memory and programmable logic to offload deterministic tasks, protocol bridging, and timing-critical functions.
• I/O Expansion and Interface Bridging  Leverage a high I/O count to connect multiple peripherals, sensors, or legacy interfaces on a compact 256‑LBGA footprint.

Unique Advantages

• Highly configurable logic capacity: 4,032 logic elements and a 200,000-gate equivalent allow tailored hardware implementations without fixed-function constraints.
• On-chip memory for local data handling: Approximately 0.295 Mbits of embedded RAM enables local buffering and state retention without external memory.
• Large I/O complement: 195 user I/Os simplify system integration by reducing the need for external I/O expanders.
• Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in industrial temperature environments.
• Compact surface-mount package: 256‑LBGA (256‑FTBGA, 17×17) provides a space-efficient solution for high-density boards.
• Low-voltage core: 1.14 V to 1.26 V supply range supports low-power system design considerations.

Why Choose XC3S200AN-4FT256I?

The XC3S200AN-4FT256I positions itself as a compact, industrial-grade FPGA option that combines moderate logic capacity, embedded memory, and a substantial I/O count in a 256‑LBGA package. Its temperature rating, RoHS compliance, and surface-mount form factor make it suitable for embedded and industrial designs where programmable logic and reliable operation are required.

This device is appropriate for engineers and procurement teams seeking a balanced FPGA solution for custom logic implementations, I/O-heavy designs, and systems that must operate across extended temperature ranges while maintaining a compact board footprint.

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