XC3S200AN-5FTG256C

The XC3S200AN-5FTG256C is a Spartan‑3AN field programmable gate array (FPGA) in a 256‑ball L‑BGA package. It delivers 4,032 logic elements with approximately 0.29 Mbits of embedded RAM and a I/O count of 195 for compact, reprogrammable digital designs.

This device operates from a 1.14 V to 1.26 V core supply, is supplied in a surface‑mount 256‑FTBGA (17×17) package, and is rated for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Logic Capacity Provides 4,032 logic elements to implement custom digital logic and finite state machines.
• Embedded Memory Approximately 0.29 Mbits (294,912 bits) of on‑chip RAM for buffering, FIFOs, and distributed memory needs.
• I/O and Gate Count 195 I/O pins and approximately 200,000 gates to support dense interfacing and integration.
• Package and Mounting 256‑LBGA package (supplier device package: 256‑FTBGA, 17×17) in a surface‑mount form factor for compact PCB layouts.
• Power Core supply range of 1.14 V to 1.26 V to match low‑voltage system rails.
• Operating Range and Grade Commercial grade operation from 0 °C to 85 °C suitable for standard commercial applications.
• Environmental Compliance RoHS compliant for hazard‑reduction requirements.

Unique Advantages

• Moderate logic density: 4,032 logic elements enable implementation of mid‑range FPGA designs without over‑provisioning.
• On‑chip RAM: Approximately 0.29 Mbits of embedded memory reduces the need for external RAM in many control and buffering tasks.
• High I/O count in a compact package: 195 I/Os in a 256‑LBGA footprint allow substantial external connectivity while conserving PCB area.
• Low‑voltage core: 1.14 V–1.26 V supply makes the device compatible with low‑voltage power rails common in modern systems.
• Surface‑mount packaging: 256‑FTBGA (17×17) surface‑mount package supports automated assembly and dense board integration.
• Regulatory and temperature suitability: RoHS compliance and commercial temperature rating support standard commercial product deployments.

Why Choose XC3S200AN-5FTG256C?

The XC3S200AN-5FTG256C balances moderate logic capacity, embedded RAM, and a high I/O count in a compact 256‑LBGA surface‑mount package. Its voltage and temperature ratings, together with RoHS compliance, make it a pragmatic choice for commercial designs that require reconfigurable logic, on‑chip memory, and substantial external connectivity without moving to larger FPGA families.

This device is well suited for engineering teams and procurement focused on scalable, board‑level digital integration where package density, logic resources, and I/O availability must be matched to system requirements.

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