XC3S250E-4FT256C

The XC3S250E-4FT256C is a Spartan®-3E field programmable gate array (FPGA) in a 256-LBGA package designed for commercial embedded logic applications. It combines 5,508 logic elements with approximately 0.22 Mbits of on-chip RAM, 172 user I/O pins and a 250,000-gate capacity to support mid-density logic integration in a compact surface-mount package.

Key Features

• Core Logic 5,508 logic elements provide a balanced resource pool for implementing medium-complexity digital logic and state-based designs.
• Embedded Memory Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, FIFOs and small data stores directly inside the FPGA fabric.
• I/O Capacity 172 device I/O pins accommodate a wide range of peripheral interfaces and parallel connections in compact systems.
• Gate Density Specified at 250,000 gates, enabling integration of multiple control, glue-logic and signal-processing functions into a single device.
• Power Core supply voltage range of 1.14 V to 1.26 V, supporting low-voltage FPGA system architectures.
• Package & Mounting 256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for high-density PCB assembly.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard indoor and controlled-environment electronics.
• Regulatory RoHS compliant.

Unique Advantages

• Balanced logic-to-memory ratio: 5,508 logic elements combined with 221,184 bits of on-chip RAM enable efficient partitioning of control logic and local data storage.
• High I/O density: 172 user I/Os provide flexibility for interfacing multiple sensors, peripherals or parallel buses without external I/O expanders.
• Compact BGA footprint: 256-LBGA / 256-FTBGA (17×17) packaging supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Defined power envelope: Low-voltage core operation (1.14 V–1.26 V) helps designers plan power distribution and thermal profiles precisely.
• Commercial-grade reliability: 0 °C to 85 °C operating range and RoHS compliance align with mainstream embedded product requirements.
• Predictable integration capacity: 250,000 gates provide a clear sizing metric for consolidating multiple discrete functions into a single FPGA device.

Why Choose XC3S250E-4FT256C?

The XC3S250E-4FT256C positions itself as a mid-density FPGA option for designers who need a compact, surface-mount solution with a well-defined mix of logic, memory and I/O resources. Its combination of 5,508 logic elements, approximately 0.22 Mbits of embedded RAM and 172 I/Os makes it suitable for consolidating control, interfacing and buffering functions in commercial embedded systems.

Choose this part when you need a commercially graded, RoHS-compliant FPGA in a 256-LBGA package with a clear power and thermal profile. The device’s documented gate and resource counts simplify capacity planning and long-term design scalability within mainstream electronic product lines.

Request a quote or submit an inquiry for XC3S250E-4FT256C to receive pricing and availability information for your design requirements.