XC3S250E-4FTG256I

The XC3S250E-4FTG256I is a Spartan®-3E FPGA from AMD, delivering a balanced mix of logic density, on-chip memory, and I/O in a compact BGA package. It provides measurable FPGA resources—including logic elements, on-chip RAM and a substantial I/O count—making it suitable for designs that require mid-range programmable logic capacity with industrial-grade temperature capability.

Key Features

• Logic Resources  612 logic blocks providing 5,508 logic elements and approximately 250,000 gates, enabling implementation of moderate-complexity programmable logic functions.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (221,184 total bits) for buffering, FIFOs, and state storage without immediate dependence on external memory.
• I/O Capability  172 user I/O pins to interface with peripherals, sensors, and other digital devices.
• Power  Device operates from a 1.14 V supply as specified, simplifying power budgeting for designs matched to this rail.
• Package & Mounting  256-FTBGA (17×17) supplier device package in a surface-mount form factor; parts are supplied in tray packaging.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C and specified as Industrial grade for use in applications requiring extended temperature performance.

Unique Advantages

• Balanced logic and memory mix: 5,508 logic elements combined with approximately 0.22 Mbits of on-chip RAM enables implementation of control, glue logic, and moderate buffering without immediate external memory.
• High I/O density: 172 I/O pins provide flexible connectivity options to external devices and subsystems, reducing the need for additional interface hardware.
• Compact BGA footprint: The 256-FTBGA (17×17) package supports space-constrained board layouts while maintaining substantial FPGA resources.
• Industrial temperature capability: Rated from -40 °C to 100 °C for designs that require wider operating temperature margins.
• Consistent supply requirement: Single nominal 1.14 V supply simplifies power delivery design for compatible systems.

Why Choose XC3S250E-4FTG256I?

The XC3S250E-4FTG256I positions itself as a mid-range Spartan®-3E FPGA option from AMD, offering a practical combination of logic elements, on-chip RAM, and a high I/O count in a 256-FTBGA package. Its industrial temperature rating and surface-mount form factor make it suitable for engineered designs that require reliable programmable logic resources within the specified electrical and environmental limits.

This part is appropriate for customers and designs that need a defined set of logic and memory resources, significant I/O flexibility, and an industrial operating range—backed by AMD as the manufacturer.

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