XC3S250E-4PQG208C

The XC3S250E-4PQG208C is a Spartan®-3E field programmable gate array (FPGA) from AMD, supplied in a 208-BFQFP surface-mount package. It provides a balance of logic capacity, embedded memory, and I/O for commercial-grade digital designs.

Key resources include 5,508 logic elements and 612 CLBs, approximately 0.22 Mbits of on-chip RAM, 158 user I/O pins, a supply voltage range of 1.14 V to 1.26 V, and commercial operating temperature rated from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  5,508 logic elements and 612 CLBs provide configurable digital logic resources for custom function implementation.
• On-Chip Memory  Approximately 0.22 Mbits of embedded RAM available for buffering, state storage, and small data structures.
• I/O  158 user I/O pins support external interface and peripheral connectivity within a compact package.
• Power  Low-voltage core operation with a specified supply range of 1.14 V to 1.26 V.
• Package & Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for board-level integration.
• Environmental & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
• Gate Density  Approximately 250,000 gates for implementing medium-complexity digital systems.

Typical Applications

• Commercial Embedded Systems  Implement custom control, interface logic, and peripheral glue for commercial embedded devices within the specified temperature range.
• Prototyping and Development  Use the FPGA to validate digital designs and iterate hardware logic before committing to ASIC or discrete solutions.
• I/O Expansion and Interface Bridging  Leverage 158 I/O pins to add or adapt interfaces between processors, sensors, and peripherals on a compact PCB footprint.

Unique Advantages

• Balanced Logic Capacity: 5,508 logic elements and 612 CLBs deliver sufficient resources for medium-complexity designs without excessive board-level cost.
• Compact Embedded Memory: Approximately 0.22 Mbits of on-chip RAM reduces the need for external memory for small buffering and state storage tasks.
• Generous I/O Count: 158 I/O pins simplify integration with multiple peripherals and interfaces, reducing external component count.
• Surface-Mount BFQFP Package: 208-pin BFQFP in a 28×28 supplier footprint supports dense PCB layouts and standard assembly processes.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet typical commercial deployment environments.
• RoHS Compliant: Meets regulatory requirements for lead-free manufacturing and environmental compliance.

Why Choose XC3S250E-4PQG208C?

The XC3S250E-4PQG208C positions itself as a practical FPGA option for commercial embedded designs that require a measured combination of logic elements, embedded RAM, and I/O density in a surface-mount BFQFP package. Its specified supply voltage and operating temperature range make it suitable for standard commercial environments where RoHS compliance is required.

This device is appropriate for engineers and procurement teams looking for a mid-range Spartan®-3E FPGA from AMD that offers configurable logic resources, on-chip memory, and a compact package for board-level integration and prototyping efforts.

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