XC3S250E-4FTG256C

The XC3S250E-4FTG256C is a Spartan®-3E field programmable gate array (FPGA) supplied in a 256-LBGA package. It provides 5,508 logic elements driven by 612 configurable logic blocks (CLBs), approximately 0.22 Mbits of on-chip RAM, and 172 user I/O pins in a compact surface-mount package.

Designed for commercial-grade programmable logic applications, this device combines moderate logic density, embedded memory, and a high I/O count with a 1.14 V to 1.26 V core supply and a 0 °C to 85 °C operating range.

Key Features

• Core Logic  612 configurable logic blocks (CLBs) and 5,508 logic elements provide the programmable core capacity for implementing custom digital functions.
• Embedded Memory  Approximately 0.22 Mbits (221,184 bits) of on-chip RAM for buffering, small lookup tables, and local storage.
• I/O Density  172 user I/O pins to support multiple parallel interfaces and I/O-rich designs.
• Logic Gate Equivalent  Approximately 250,000 gates, enabling medium-complexity logic implementations.
• Power  Core voltage range from 1.14 V to 1.26 V to match platform power delivery requirements.
• Package & Mounting  256-LBGA (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor to minimize board footprint.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for lead-free manufacturing and regulatory conformance.

Typical Applications

• Custom Digital Logic  Implement medium-complexity, application-specific logic where programmable resources and embedded RAM are required.
• I/O-Intensive Interfaces  Use the 172 I/O pins to handle parallel peripherals, custom interfaces, and board-level signal aggregation.
• Prototyping and Development  Employ the device for design validation and FPGA-based prototyping that requires commercial-grade operating conditions.

Unique Advantages

• Balanced Logic and Memory: 5,508 logic elements paired with approximately 0.22 Mbits of embedded RAM deliver a practical mix of resources for a wide range of designs.
• High I/O Capacity: 172 user I/O pins enable flexible interfacing and reduce the need for external I/O expanders.
• Compact BGA Footprint: The 256-LBGA / 256-FTBGA (17×17) package supports dense board layouts while preserving surface-mount assembly advantages.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet standard commercial environment requirements.
• RoHS Compliant: Designed to support lead-free manufacturing and environmental compliance needs.

Why Choose XC3S250E-4FTG256C?

The XC3S250E-4FTG256C provides a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 256-LBGA surface-mount package. Its commercial-grade temperature range and RoHS compliance make it a fit for mainstream programmable logic designs that require moderate gate density and reliable on-chip resources.

This device is well suited to engineers and developers building custom digital systems, I/O-rich interfaces, and prototypes where a balanced set of FPGA resources and a compact package are priorities.

If you would like pricing or availability, request a quote or submit an inquiry to receive further purchasing information and lead-time details.