XC3S250E-4FT256I

The XC3S250E-4FT256I is a Spartan®-3E field programmable gate array (FPGA) from AMD supplied in a 256-LBGA package. It combines a mid-range logic capacity with on-chip RAM and a broad I/O complement to address embedded, industrial, and system-control applications.

With 5,508 logic elements, 612 CLBs, approximately 0.22 Mbits of embedded memory and 172 I/O, this device targets designs requiring a balance of integration, configurable logic resources, and industrial-grade environmental capability.

Key Features

• Logic Capacity — 5,508 logic elements across 612 CLBs provide programmable resources for combinational and sequential logic functions.
• Embedded Memory — Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) supports data buffering, FIFOs and small working-storage needs within the FPGA.
• I/O Resources — 172 I/O pins enable connection to a wide range of external peripherals and interfaces.
• Gate Count — Equivalent to 250,000 gates for estimating design scope and integration density.
• Power — Core voltage supply range of 1.14 V to 1.26 V facilitates predictable power budgeting for the FPGA core.
• Package & Mounting — 256-LBGA (supplier device package: 256-FTBGA 17×17) in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control — Use for programmable logic, I/O aggregation and timing-critical control functions in industrial equipment, supported by an industrial temperature rating.
• Embedded Systems — Integrate custom logic, memory buffering and peripheral interfaces for compact embedded applications using the device’s logic elements and on-chip RAM.
• Communications and Interfaces — Implement protocol bridging, parallel/serial I/O conditioning, and glue logic leveraging 172 I/O pins and configurable logic resources.

Unique Advantages

• Balanced Logic and Memory: 5,508 logic elements combined with approximately 0.22 Mbits of embedded RAM enable both control logic and modest data storage on-chip, reducing external memory needs.
• Ample I/O Count: 172 I/O pins allow flexible interfacing to sensors, peripherals and external buses without excessive board-level multiplexing.
• Industrial-Grade Temperature Range: Rated from -40 °C to 100 °C for deployment in harsher operating environments.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) supports high-density PCB layouts while maintaining a manageable footprint.
• Predictable Power Envelope: Core voltage supply range of 1.14 V to 1.26 V helps with accurate power-supply planning and thermal design.
• Environmental Compliance: RoHS compliance simplifies regulatory and manufacturing considerations for lead-free production.

Why Choose XC3S250E-4FT256I?

The XC3S250E-4FT256I positions itself as a versatile, industrial-grade FPGA option for designs that require a mid-level mix of programmable logic, embedded memory and I/O density. Its combination of 5,508 logic elements, 612 CLBs, and 172 I/O supports integration of control, interfacing and buffering functions into a single programmable device.

This FPGA is well suited for engineers and procurement teams implementing compact embedded systems, industrial controllers, or interface concentrators who need a predictable power profile, industrial temperature capability and RoHS compliance in a 256-LBGA surface-mount package.

Request a quote or submit a procurement inquiry today to evaluate XC3S250E-4FT256I for your next design.