XC3S250E-4CPG132I

The XC3S250E-4CPG132I is a Spartan‑3E field programmable gate array (FPGA) in a 132‑TFBGA/CSPBGA package designed for industrial applications. It integrates programmable logic, on-chip memory, and a substantial I/O count to enable compact, reconfigurable digital designs.

With 612 CLBs providing 5,508 logic elements, approximately 0.22 Mbits of embedded RAM and 92 user I/Os, this device targets designs that require moderate logic capacity, flexible interfacing and operation across an industrial temperature range.

Key Features

• Programmable Logic — 612 CLBs delivering 5,508 logic elements and roughly 250,000 equivalent gates for implementing custom digital functions.
• On‑Chip Memory — 221,184 bits of embedded RAM (approximately 0.22 Mbits) for buffering, small data tables and state storage without external memory.
• I/O Capacity — 92 general-purpose I/O pins to support a variety of peripheral interfaces and board-level connections.
• Power — Core supply operating from 1.14 V to 1.26 V to match system power constraints and allow predictable power planning.
• Package & Mounting — 132‑TFBGA (132‑CSPBGA, 8×8) BGA package with surface-mount mounting type for space-efficient board integration.
• Industrial Temperature Range — Rated to operate from −40 °C to 100 °C, suitable for environments requiring extended temperature tolerance.
• Regulatory Compliance — RoHS compliant for lead‑free assembly and regulatory alignment.

Unique Advantages

• Balanced Logic and Memory — The combination of 5,508 logic elements and approximately 0.22 Mbits of embedded RAM supports mixed control, glue-logic and modest data buffering without external components.
• Sizable I/O Count — Ninety‑two I/O pins enable direct connection to multiple peripherals, sensors and interfaces, reducing the need for extra I/O expanders.
• Compact BGA Footprint — The 132‑TFBGA/CSPBGA package offers a compact solution for space-constrained PCBs while maintaining robust routing options.
• Industrial Temperature Capability — Specified −40 °C to 100 °C operation supports deployment in harsher environments where extended temperature tolerance is required.
• Predictable Power Envelope — A defined core voltage range (1.14 V–1.26 V) helps streamline power-supply design and thermal planning.
• RoHS Compliance — Meets lead‑free requirements for modern assembly and environmental regulations.

Why Choose XC3S250E-4CPG132I?

The XC3S250E-4CPG132I positions itself as a practical, industrial‑rated FPGA option for designs that need a balance of programmable logic, embedded RAM and a healthy number of I/Os in a compact BGA package. Its specifications make it suitable for applications where moderate gate density, reliable operation across −40 °C to 100 °C and lead‑free compliance are important design considerations.

Engineers and procurement teams selecting this device can expect a well-defined set of hardware characteristics—logic capacity, memory size, I/O availability, package type and power requirements—to guide board-level integration and system planning.

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