XC3S200AN-5FT256C

The XC3S200AN-5FT256C is a Spartan®-3AN field programmable gate array (FPGA) offered in a compact 256-FTBGA (17×17) package for surface-mount assembly. It combines moderate logic density, on-chip memory, and a substantial I/O count to address a range of commercial electronic designs.

Designed for commercial-temperature applications, this device provides a balance of logic elements, embedded memory, and I/O capability suitable for embedded systems, consumer and business electronics, and custom control or interface functions.

Key Features

• Logic Capacity — 448 logic blocks and 4,032 logic elements (cells), providing approximately 200,000 gates for implementing custom digital logic and control functions.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM (294,912 bits) to support buffers, FIFOs, and small data stores without external memory.
• I/O Resources — 195 user I/O pins to interface with sensors, peripherals, buses, and external devices.
• Package & Mounting — 256-FTBGA (17×17) supplier device package in surface-mount format; supplied in tray packaging for production handling.
• Power — Single supply specified at 1.14 V, simplifying supply rail requirements in targeted designs.
• Operating Conditions — Commercial operating temperature range of 0 °C to 85 °C and commercial grade classification.
• Regulatory — RoHS compliant.

Typical Applications

• Embedded Systems — Implement custom control logic, peripheral bridges, and protocol handling where moderate logic and on-chip memory are required.
• Consumer Electronics — Provide glue logic, interface conversion, and I/O expansion in space-constrained consumer and business devices.
• Custom Control and Automation — Implement application-specific control loops, state machines, and interface logic for machines and devices operating within commercial temperature ranges.
• Prototyping and Development — Validate hardware concepts and verify logic designs that require a combination of logic elements, RAM, and plentiful I/O in a compact BGA package.

Unique Advantages

• Balanced Logic and Memory — 4,032 logic elements paired with approximately 0.295 Mbits of embedded RAM supports integrated implementations without immediate external memory needs.
• Generous I/O Count — 195 I/O pins enable connectivity to multiple peripherals, sensors, and external interfaces from a single device.
• Compact BGA Footprint — The 256-FTBGA (17×17) package delivers a high pin count in a space-efficient surface-mount form factor.
• Simplified Power Planning — Single specified supply voltage (1.14 V) reduces supply complexity in system designs.
• RoHS Compliant — Conforms to lead-free manufacturing requirements for broad commercial deployment.

Why Choose XC3S200AN-5FT256C?

The XC3S200AN-5FT256C positions itself as a practical choice for designers who need moderate logic density, a useful amount of on-chip memory, and a high I/O count in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of consumer and embedded applications.

This device is well suited for teams building space-conscious hardware that requires integration of custom logic, interface management, and local buffering without immediately resorting to external memory or multiple discrete devices. The combination of logic elements, embedded RAM, and 195 I/O pins helps keep BOM complexity and board area under control.

Request a quote or submit an inquiry for XC3S200AN-5FT256C to receive pricing and availability information tailored to your production needs.