XC3S200AN-4FTG256C

The XC3S200AN-4FTG256C is a Spartan®-3AN field programmable gate array (FPGA) from AMD, provided in a 256-LBGA package. It combines a moderate logic fabric with on-chip RAM and a high I/O count to support a range of commercial embedded designs.

This device targets applications that require a balance of logic capacity, embedded memory and multiple external interfaces while operating on a low-voltage core supply in a surface-mount BGA package.

Key Features

• Core / Logic  4,032 logic elements and approximately 200,000 gates provide the programmable logic resources for custom digital functions and glue logic.
• Embedded Memory  Total on-chip RAM: 294,912 bits (approximately 0.295 Mbits) for buffering, FIFOs and small data stores.
• I/O  195 general-purpose I/O pins to connect multiple peripherals, sensors and external devices.
• Power  Core voltage supply range from 1.14 V to 1.26 V to match low-voltage system rails.
• Package & Mounting  256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting for compact board layouts.
• Operating Range & Compliance  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.

Unique Advantages

• Compact BGA footprint: The 256-LBGA (256-FTBGA, 17×17) package delivers a high pin count in a compact form factor, helping reduce board area for space-constrained designs.
• Balanced logic and memory: 4,032 logic elements combined with ~0.295 Mbits of on-chip RAM supports moderate-complexity logic functions and local buffering without external memory for some designs.
• High I/O density: 195 I/O pins enable multiple parallel interfaces and flexible system integration options.
• Low-voltage operation: Core supply range of 1.14–1.26 V aligns with low-voltage system architectures and power-optimized designs.
• Commercial temperature rating: 0 °C to 85 °C suitability for standard embedded and consumer applications.
• Environmentally compliant: RoHS compliant construction supports regulatory requirements for lead-free assemblies.

Why Choose XC3S200AN-4FTG256C?

The XC3S200AN-4FTG256C offers a practical balance of programmable logic, embedded RAM and high I/O count in a compact 256-LBGA surface-mount package from AMD. It is well suited for commercial embedded designs that need moderate gate counts, on-chip memory for buffering, and numerous external interfaces while operating on a low-voltage supply.

This device is a choice for engineers and procurement teams seeking a commercial-grade FPGA solution that integrates essential logic and memory resources with a manageable footprint and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S200AN-4FTG256C.