XC3S200AN-4FT256C

The XC3S200AN-4FT256C is a Spartan®-3AN field programmable gate array (FPGA) in a 256-LBGA package, offered in a commercial-grade specification. It combines a moderate logic capacity with on-chip memory and a wide complement of I/O to support a variety of embedded digital designs.

With 4,032 logic elements, approximately 0.295 Mbits of embedded memory, up to 195 I/O connections, and a typical gate count of 200,000, this device targets commercial applications that require flexible logic implementation in a compact surface-mount form factor.

Key Features

• Core Logic Approximately 4,032 logic elements supporting up to 200,000 gates of user logic for medium-complexity digital designs.
• Embedded Memory Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to store data and state close to the logic fabric.
• I/O Density Up to 195 general-purpose I/O pins for interfacing with peripherals, sensors, and external buses.
• Power Operates from a core supply voltage range of 1.14 V to 1.26 V for low-voltage system integration.
• Package & Mounting 256-LBGA packaged device (supplier package: 256-FTBGA, 17 × 17) intended for surface-mount assembly.
• Operating Range & Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance RoHS compliant.

Unique Advantages

• Balanced Logic and Memory: 4,032 logic elements combined with roughly 0.295 Mbits of embedded RAM provide a practical balance for control, protocol, and mid-density datapath implementations.
• High I/O Count: Up to 195 I/Os enable versatile interfacing options without external multiplexing, reducing board-level complexity.
• Compact Surface-Mount Package: The 256-LBGA (17 × 17) package supports dense board layouts while keeping the device footprint small.
• Low-Voltage Core: A core supply range of 1.14–1.26 V aligns with modern low-voltage system architectures for efficient power design.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet typical commercial-environment deployment requirements.
• RoHS Compliance: Meets RoHS requirements for use in assemblies where lead-free components are required.

Why Choose XC3S200AN-4FT256C?

The XC3S200AN-4FT256C positions itself as a commercially graded FPGA option that delivers a combination of moderate logic capacity, embedded memory, and a high I/O count in a compact 256-LBGA surface-mount package. Its specifications suit designers who need flexible, reprogrammable logic resources and on-chip memory within the 0 °C to 85 °C commercial temperature envelope.

This device is appropriate for projects that demand up to 200,000 gates of implemented logic, approximately 0.295 Mbits of embedded RAM, and up to 195 system I/Os, while maintaining RoHS compliance and a low-voltage core supply profile.

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