XC3S200A-5FTG256C

The XC3S200A-5FTG256C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD supplied in a 256-LBGA package. It provides a commercial-grade, surface-mount programmable logic solution combining thousands of logic elements, on-chip RAM, and a high I/O count for flexible digital system integration.

This device targets designs that require reconfigurable logic capacity, moderate embedded memory, and a large number of I/O pins while operating within a standard commercial temperature range and a defined core voltage window.

Key Features

• Core Logic  4,032 logic elements available for implementing custom digital logic and state machines.
• Logic Blocks  448 logic blocks (CLB-style resources) to organize and map combinational and sequential logic.
• Embedded Memory  Approximately 0.29 Mbits of total on-chip RAM (294,912 bits) for buffering, FIFOs, and small data storage.
• I/O Density  Up to 195 general-purpose I/O pins to support multiple external interfaces and parallel connections.
• Gate Capacity  Approximately 200,000 gates for sizing and estimating integration density in system designs.
• Power  Core supply voltage specified from 1.14 V to 1.26 V to match target power domains and design constraints.
• Package & Mounting  Surface-mount 256-LBGA package (supplier device package 256-FTBGA, 17×17) for compact board-level integration.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental  RoHS compliant for lead-free assembly and environmental compliance requirements.

Typical Applications

• Programmable Logic Integration  Implement custom digital logic functions and glue logic using the device's 4,032 logic elements and CLB resources.
• Interface Bridging  Use the 195 I/O pins to connect multiple external peripherals, sensors, or parallel interfaces on a single board.
• On-Chip Data Buffers  Take advantage of approximately 0.29 Mbits of embedded RAM for buffering, small FIFOs, and temporary data storage.

Unique Advantages

• High integration in a compact package: 4,032 logic elements and a 256-LBGA footprint allow significant logic density while preserving board area.
• Substantial I/O capacity: 195 I/O pins enable broad external connectivity without additional interface components.
• Defined power envelope: A specified core voltage range of 1.14 V to 1.26 V helps simplify power-supply design and validation.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match typical commercial embedded applications.
• Regulatory alignment: RoHS compliance supports lead-free assembly and environmental regulatory requirements.

Why Choose XC3S200A-5FTG256C?

The XC3S200A-5FTG256C positions itself as a practical, commercial-grade Spartan®-3A FPGA option where a balance of logic resources, embedded RAM, and high I/O count is required. Its 256-LBGA package and surface-mount mounting enable compact board layouts while the specified voltage and temperature ranges provide clear design parameters for power and thermal planning.

This FPGA is suited to designers and procurement teams seeking a documented, vendor-backed programmable logic device with mid-range capacity and significant I/O connectivity. The combination of logic elements, on-chip memory, and package density offers a scalable choice for a variety of reconfigurable digital designs.

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