XC3S200A-5VQG100C

IC FPGA 68 I/O 100VQFP
Part Description

Spartan®-3A Field Programmable Gate Array (FPGA) IC 68 294912 4032 100-TQFP

Quantity 1,495 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-TQFPNumber of I/O68Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs448Number of Logic Elements/Cells4032
Number of Gates200000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XC3S200A-5VQG100C – Spartan®-3A FPGA, 4032 Logic Elements, 100‑TQFP

The XC3S200A-5VQG100C is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD delivering programmable logic in a compact surface-mount package. It combines 4032 logic elements with approximately 294,912 bits of on-chip RAM and 68 user I/O pins to support mid-range digital designs that require configurable logic, local memory, and flexible I/O.

Key Features

  • Core Logic  4032 logic elements for implementing custom digital functions and combinational/sequential logic.
  • Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for buffering, state storage, and small lookup tables.
  • Logic Capacity  Device capacity listed as 200,000 gates, enabling integration of multiple logic functions on a single device.
  • I/O  68 user I/O pins to interface with external peripherals, sensors, and buses.
  • Power  Core voltage supply range of 1.14 V to 1.26 V for device operation.
  • Package & Mounting  100‑TQFP package case; supplier device package referenced as 100‑VQFP (14×14). Surface-mount mounting type simplifies board assembly.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C for standard electronic environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Embedded Control  Implement custom control logic and state machines using the device's 4032 logic elements and on-chip RAM.
  • I/O Bridging and Protocol Glue  Use available I/O pins to bridge peripherals or implement protocol translation and interface logic.
  • Prototyping and Development  Suitable for prototyping digital designs that require reconfigurable logic and moderate memory capacity.
  • Signal Conditioning and Pre‑processing  Local buffering and logic can be used for pre-processing digital data streams before passing to downstream systems.

Unique Advantages

  • Balanced Logic and Memory: 4032 logic elements combined with approximately 0.295 Mbits of embedded RAM provide a balanced resource set for mid-range designs.
  • Flexible I/O Count: 68 user I/O pins enable a wide range of peripheral connections without external IO expanders.
  • Compact Surface‑Mount Package: 100‑TQFP (supplier 100‑VQFP 14×14) offers a compact footprint for space-constrained PCBs.
  • Clear Power Envelope: Defined core supply range (1.14–1.26 V) simplifies power-rail planning and integration.
  • Commercial Temperature Rating: 0 °C to 85 °C operation suits standard commercial applications and development environments.
  • RoHS Compliant: Meets common environmental compliance expectations for modern electronics manufacturing.

Why Choose XC3S200A-5VQG100C?

The XC3S200A-5VQG100C offers a pragmatic combination of logic capacity, on-chip memory, and a moderate I/O count in a compact 100‑pin TQFP surface-mount package. Its specifications make it well suited for engineers building mid-range programmable logic solutions that require integration of multiple digital functions, local buffering, and flexible interfacing within commercial temperature environments.

As a Spartan®-3A device from AMD, this FPGA fits designs where reconfigurability, scalable logic resources, and adherence to RoHS are priorities. It is appropriate for teams seeking an FPGA platform that balances integration density and package compactness for prototyping or volume deployment in standard electronic products.

If you would like pricing or availability, request a quote or submit an inquiry referencing XC3S200A-5VQG100C and your project requirements.

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