XC3S200AN-4FTG256I

The XC3S200AN-4FTG256I is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC offering a balanced combination of programmable logic, on-chip memory, and I/O density in a compact BGA package. It is specified for industrial operation and provides a configurable platform for integrating custom digital functions into system designs.

With thousands of logic elements, substantial embedded RAM, and nearly 200 I/O, this device is suited to projects that require flexible logic implementation, moderate on-chip storage, and robust board-level packaging.

Key Features

• Core Logic — 448 configurable logic blocks (CLBs) delivering 4,032 logic elements for implementing custom digital logic and state machines.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for buffering, FIFOs, and localized storage.
• I/O and Gate Count — 195 available I/O pins and a device gate-equivalent count of 200,000 to support a variety of external interfaces and logic complexity.
• Power — Core voltage supply specified from 1.14 V to 1.26 V for the programmable logic core.
• Package & Mounting — 256-LBGA package; supplier device package listed as 256-FTBGA (17×17); surface-mount mounting for compact board integration.
• Operating Range — Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• Integrated Logic and Memory: Combines 4,032 logic elements with on-chip RAM to reduce external component count and simplify PCB routing.
• High I/O Density: 195 I/O pins enable broad connectivity options to peripherals, sensors, and external devices.
• Industrial Temperature Suitability: Rated from −40 °C to 100 °C to support designs intended for harsh or variable environments.
• Low-Voltage Core: Narrow core supply range (1.14 V–1.26 V) supports designs targeting modern low-voltage logic domains.
• Compact BGA Footprint: 256-LBGA/256-FTBGA (17×17) packaging provides a compact, board-friendly form factor for space-constrained applications.

Why Choose XC3S200AN-4FTG256I?

The XC3S200AN-4FTG256I positions itself as a dependable, industrial-grade FPGA option for engineers needing a compact programmable device with moderate logic capacity, embedded RAM, and substantial I/O. Its combination of 4,032 logic elements, approximately 0.295 Mbits of on-chip memory, and a 195-pin I/O count makes it well suited to designs where integration, footprint, and operating temperature range matter.

For teams working on industrial embedded systems or board-level prototypes that require configurable logic and robust packaging, this device offers a practical balance of resources and form factor supported by RoHS compliance and defined electrical and thermal specifications.

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