XC3S250E-4CP132I

The XC3S250E-4CP132I is an industrial-grade Spartan®-3E field programmable gate array (FPGA) IC from AMD. It integrates 5,508 logic elements, approximately 0.22 Mbits of embedded memory, and 92 user I/Os in a compact 132-TFBGA (132-CSPBGA, 8×8) surface-mount package.

With a core supply window of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require moderate logic capacity, on-chip RAM, and a robust industrial temperature rating.

Key Features

• Core Logic  Provides 5,508 logic elements suitable for implementing custom combinational and sequential logic functions.
• Embedded Memory  Includes 221,184 bits of on-chip RAM (approximately 0.22 Mbits) for data buffering, FIFOs, and small lookup tables.
• I/O Density  Offers 92 I/O pins to support multiple peripheral interfaces and parallel I/O configurations.
• Package & Mounting  Delivered in a 132-TFBGA / 132-CSPBGA (8×8) surface-mount package for compact board implementations.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match required FPGA core rails.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, aligning with industrial environment demands.
• Regulatory Compliance  RoHS-compliant construction for environmental regulatory conformity.
• Density Metric  Approximately 250,000 equivalent gates for quick reference to silicon capacity.

Typical Applications

• Industrial Control  Use the industrial temperature rating and 92 I/Os for programmable logic in factory automation, sensor interfaces, and control loops.
• Embedded Systems  Integrate the on-chip RAM and logic elements to implement custom processing blocks, protocol handling, and glue logic in embedded designs.
• Communications & I/O Aggregation  Leverage the I/O count and logic resources for parallel data handling, protocol conversion, and interface bridging.
• Prototyping and Development  Employ the compact 132-TFBGA package and moderate logic density for board-level prototyping and evaluation of FPGA-based designs.

Unique Advantages

• Industrial Temperature Rating: Designed to operate from −40 °C to 100 °C, enabling deployment in harsher environments where temperature resilience is required.
• Balanced Logic and Memory: A combination of 5,508 logic elements and ~0.22 Mbits of embedded RAM supports a wide range of mid‑level logic and buffering needs.
• Ample I/O Count: With 92 I/Os, the device accommodates multiple peripheral interfaces and parallel connections without external expander chips.
• Compact Surface-Mount Package: The 132-CSPBGA (8×8) package enables high-density PCB integration while maintaining accessible I/O routing.
• Low-Voltage Core: A narrow core supply range of 1.14 V–1.26 V simplifies power supply design for the FPGA core domain.
• RoHS Compliance: Environmentally compliant construction supports green manufacturing requirements.

Why Choose XC3S250E-4CP132I?

The XC3S250E-4CP132I offers a practical balance of logic capacity, embedded memory, and I/O resources in a package and temperature grade suited for industrial applications. Its specifications make it a suitable choice for engineers building mid-density FPGA solutions that require reliable operation across a wide temperature range and a compact board footprint.

Backed by AMD's Spartan®-3E product lineage, this device provides predictable silicon resources and supply characteristics for designs focused on moderate logic integration, on-chip buffering, and flexible I/O arrangements.

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