XC3S250E-4CPG132C

The XC3S250E-4CPG132C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC designed for commercial-grade programmable logic applications. It provides a balance of logic capacity, embedded memory, and I/O support for designs that require moderate gate counts and flexible interfacing.

Key attributes include 612 configurable logic blocks (CLBs) equivalent to 5,508 logic elements, approximately 221,184 bits of on-chip RAM, 92 I/O lines, and a surface-mount 132-TFBGA (132-CSPBGA 8×8) package, with an operating voltage range of 1.14 V to 1.26 V and a commercial temperature rating of 0 °C to 85 °C.

Key Features

• Logic Capacity 612 CLBs delivering 5,508 logic elements and a gate equivalent of 250,000 gates for implementing custom digital functions and control logic.
• Embedded Memory Approximately 221,184 bits of on-chip RAM to support FIFOs, buffering, and localized data storage without external memory in many designs.
• I/O and Integration 92 general-purpose I/O pins enable broad interfacing to peripherals, sensors, and external devices in compact systems.
• Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
• Package and Mounting 132-TFBGA / 132-CSPBGA (8×8) surface-mount package for compact board integration and high-density PCB designs.
• Temperature and Grade Commercial-grade device rated for 0 °C to 85 °C operation and specified as Commercial grade.
• Regulatory RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems Implement custom control logic, protocol handling, or glue logic where 5,508 logic elements and 92 I/Os meet system requirements.
• Prototyping and Development Use the FPGA’s configurable resources and embedded memory for hardware validation and iterative design refinement.
• Interface and Peripheral Aggregation Consolidate multiple peripheral interfaces and I/O functions into a single programmable device to reduce board complexity.

Unique Advantages

• Balanced Logic and Memory: 5,508 logic elements paired with approximately 221,184 bits of on-chip RAM enable a wide range of mid-size logic and buffering functions without external memory.
• Robust I/O Count: 92 I/O pins provide flexibility to connect multiple peripherals, sensors, and interfaces within a single FPGA.
• Compact, Surface-Mount Package: 132-TFBGA (132-CSPBGA 8×8) package supports high-density PCB layouts for space-constrained designs.
• Low-Voltage Core Operation: 1.14 V to 1.26 V supply range aligns with low-voltage system architectures to simplify power design.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• RoHS Compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose XC3S250E-4CPG132C?

The XC3S250E-4CPG132C positions itself as a practical FPGA choice for commercial designs that require a moderate mix of logic density, embedded memory, and flexible I/O in a compact surface-mount package. Its combination of 612 CLBs (5,508 logic elements), approximately 221,184 bits of on-chip RAM, and 92 I/Os enables implementation of control logic, interface aggregation, and mid-size digital subsystems with minimal external components.

This part is suitable for engineers and procurement teams building commercial products who need a programmable, RoHS-compliant FPGA with a predictable operating window (1.14 V–1.26 V, 0 °C–85 °C) and a compact 132-TFBGA footprint for space-conscious board designs.

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