XC3S250E-4PQ208I

The XC3S250E-4PQ208I is an AMD Spartan®-3E field programmable gate array (FPGA) in a 208-BFQFP package. It provides a compact, surface-mount FPGA solution with 5,508 logic elements, approximately 0.22 Mbits of embedded memory, and 158 user I/Os.

Designed for industrial-grade environments, this device combines programmable logic density and on-chip memory with a defined operating voltage and temperature range to support reliable system-level integration.

Key Features

• Core Logic  5,508 logic elements enabling custom digital logic implementation and moderate complexity designs.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM (total RAM bits: 221,184) to support buffering, small FIFOs, and state storage.
• I/O Count  158 user I/Os for peripheral interfacing, bus connections, and system glue logic.
• Gate Equivalent  Approximately 250,000 gates of logic capacity for integrating multiple functions on a single device.
• Power and Core Voltage  Core supply range specified at 1.14 V to 1.26 V for compatibility with defined power domains and regulator designs.
• Package and Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting for compact PCBs and automated assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Regulatory  RoHS compliant to support lead-free manufacturing and environmental requirements.

Typical Applications

• Embedded digital systems  Implement custom control logic and peripheral interfaces using the 5,508 logic elements and 158 I/Os.
• Interface bridging and protocol glue  Use on-chip logic and memory to adapt or bridge between different digital buses and peripherals.
• Prototyping and development  Evaluate and validate digital designs in a surface-mount, industrial-grade FPGA package.

Unique Advantages

• Balanced logic and memory resources: The combination of 5,508 logic elements and approximately 0.22 Mbits of embedded RAM supports a wide range of mid-scale logic functions without external memory.
• Generous I/O count: 158 user I/Os enable flexible system partitioning and numerous peripheral connections on a single device.
• Industrial temperature rating: Operation from −40 °C to 100 °C helps ensure reliable performance in harsh or temperature-variable applications.
• Compact, surface-mount package: The 208-BFQFP (208-PQFP, 28×28) simplifies PCB layout for space-constrained designs while supporting standard assembly processes.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XC3S250E-4PQ208I?

The XC3S250E-4PQ208I positions itself as a practical, industrial-grade Spartan-3E FPGA option that combines moderate logic density, embedded memory, and a high I/O count in a compact surface-mount package. Its defined core voltage range and extended operating temperature make it suitable for robust hardware designs where predictable electrical and thermal characteristics matter.

This FPGA is well suited to engineers and procurement teams looking for a reliable, mid-capacity programmable logic device for embedded systems, interface logic, and prototyping tasks, delivering long-term value through a balance of resources and industrial operating specifications.

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