XC3S250E-4PQG208I

The XC3S250E-4PQG208I is a Spartan®-3E Field Programmable Gate Array (FPGA) manufactured by AMD. It combines programmable logic, embedded memory, and a substantial I/O count in a 208-pin BFQFP package for industrial-grade applications.

With 5,508 logic elements across 612 configurable logic blocks (CLBs), approximately 0.22 Mbits of embedded RAM, and 158 I/O, this device targets designs that require mid-range logic capacity, flexible interfacing, and operation over extended temperature and voltage ranges.

Key Features

• Core Logic  5,508 logic elements implemented across 612 configurable logic blocks (CLBs) provide mid-range programmable logic capacity suitable for customized digital functions.
• Embedded Memory  Approximately 0.22 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O and Gate Count  158 user I/O pins and a device gate count of 250,000 enable a wide range of peripheral interfacing and system integration.
• Power  Core voltage operation specified between 1.14 V and 1.26 V to match system power-rail constraints.
• Package & Mounting  Available in a 208-BFQFP package (supplier package: 208-PQFP, 28×28), designed for surface-mount assembly.
• Temperature Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for deployment in demanding environmental conditions.
• Regulatory Compliance  RoHS compliant to meet lead-free assembly and environmental requirements.

Typical Applications

• Industrial Control  Use the industrial-grade temperature range and flexible logic to implement custom control algorithms, sequencing, and I/O aggregation in factory or process automation systems.
• Communications Interfaces  Leverage 158 I/O pins and mid-range logic capacity for protocol bridging, custom interface logic, and signal conditioning in communication equipment.
• Embedded System Glue Logic  Deploy the FPGA as configurable system glue to consolidate multiple discrete components, using on-chip RAM for buffering and state management.

Unique Advantages

• Right-sized Logic Capacity: 5,508 logic elements and 612 CLBs deliver a balance of programmable resources for mid-complexity designs without over-provisioning.
• Embedded Memory On-board: Approximately 0.22 Mbits of RAM supports buffering and lookup functions, reducing external memory requirements.
• Broad I/O Count: 158 I/O pins enable integration with multiple peripherals and mixed-signal front ends within a single device.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and identified as industrial grade for consistent performance in challenging environments.
• Compact Surface-Mount Package: 208-BFQFP (28×28) supports standard PCB assembly processes while providing substantial pin availability.
• RoHS Compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose XC3S250E-4PQG208I?

The XC3S250E-4PQG208I positions itself as a dependable, mid-capacity FPGA option for industrial designs that need a mix of programmable logic, embedded memory, and ample I/O in a compact surface-mount package. Its specified core voltage range and industrial operating temperature make it suitable for systems that demand stability across varied power and thermal conditions.

Manufactured by AMD and built with a clear set of logic, memory, and I/O resources, this device is appropriate for engineers seeking a balanced FPGA solution for control, interface, and integration tasks where long-term robustness and RoHS compliance are required.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S250E-4PQG208I.