XC3S250E-4TQG144I

The XC3S250E-4TQG144I is a Spartan®-3E Field Programmable Gate Array (FPGA) supplied in a 144-LQFP package. It delivers 5,508 logic elements and approximately 250,000 gates with on-chip embedded memory and a substantial I/O count for configurable digital designs.

Designed for industrial applications, the device supports a core voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C. Its surface-mount 144-pin package and RoHS compliance make it suitable for production assemblies requiring programmable logic capacity and industrial temperature tolerance.

Key Features

• Core Logic  Approximately 5,508 logic elements providing programmable combinational and sequential resources for custom digital functions.
• Logic Structure  612 configurable logic block count (as specified) to organize logic and routing resources.
• Embedded Memory  Total on-chip RAM of 221,184 bits, equivalent to approximately 0.22 Mbits of embedded memory for data buffering and state storage.
• I/O and Gate Count  108 user I/O pins and approximately 250,000 gates to support interfacing and logic density requirements.
• Power  Core voltage supply range of 1.14 V to 1.26 V for compatible power-rail designs.
• Package and Mounting  144-LQFP surface-mount package (supplier device package: 144-TQFP, 20×20) suitable for compact PCB layouts.
• Temperature and Grade  Industrial grade with operating temperature from -40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic for control systems that benefit from industrial temperature range and a flexible I/O set.
• Prototyping and Development  Use as a configurable logic platform leveraging 5,508 logic elements and on-chip RAM for design validation and iteration.
• I/O-Intensive Systems  Systems requiring multiple external interfaces can take advantage of the 108 available I/O pins for sensor, actuator, or peripheral connectivity.
• Embedded Processing  Custom embedded functions and data buffering using the device’s embedded memory and logic resources for tailored control or pre-processing tasks.

Unique Advantages

• Balanced Logic and Memory:  Approximately 5,508 logic elements combined with ~0.22 Mbits of embedded RAM provide a practical mix of logic capacity and on-chip storage for many mid-range designs.
• Industrial Temperature Tolerance:  Rated from -40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact Surface-Mount Package:  144-LQFP (supplier 144-TQFP, 20×20) enables compact PCB integration while providing ample I/O access.
• Clear Power Envelope:  Core voltage specified between 1.14 V and 1.26 V simplifies power-rail planning for system designers.
• Regulatory Compliance:  RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose XC3S250E-4TQG144I?

The XC3S250E-4TQG144I positions itself as a practical, industrial-grade FPGA option for designs needing mid-range logic capacity, embedded memory, and a solid set of I/O in a compact surface-mount package. Its specified operating temperature range and RoHS compliance make it suitable where environmental tolerance and regulatory conformity are required.

Designers targeting industrial control, I/O-rich embedded systems, or prototype platforms can leverage the device’s programmable nature and feature balance to simplify system architecture and reduce the need for external components.

Request a quote or submit an inquiry to our sales team to receive pricing, availability, and ordering information for the XC3S250E-4TQG144I.