XC3S250E-4TQG144C

The XC3S250E-4TQG144C is a Spartan®-3E Field Programmable Gate Array (FPGA) IC in a 144-LQFP surface-mount package from AMD. It provides a mid-range combination of logic capacity, on-chip memory, and I/O density suitable for commercial embedded and digital designs.

With 5,508 logic elements, approximately 0.22 Mbits of embedded memory, 108 I/O pins, and support for a 1.14 V to 1.26 V core supply in a compact 144-LQFP package, this device targets applications that require flexible digital implementation in a standard commercial temperature range (0 °C to 85 °C).

Key Features

• Core Logic 5,508 logic elements provide programmable resources for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.22 Mbits of on-chip RAM support buffering, small data storage and lookup tables within the FPGA fabric.
• I/O Density 108 user I/O pins enable interfacing with peripherals, sensors, and external logic devices.
• Gate Count Equivalent to 250,000 gates for estimating design scope and partitioning.
• Power Supply Core supply range of 1.14 V to 1.26 V for compatibility with standard FPGA power architectures.
• Package & Mounting 144-LQFP (surface mount) package in a 20 × 20 mm footprint for compact PCB integration.
• Operating Range & Grade Commercial operating temperature of 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• Custom Logic and Glue Logic Use the 5,508 logic elements to implement protocol translation, control state machines, and board-level glue logic.
• On-chip Data Handling Approximately 0.22 Mbits of embedded RAM can be used for small FIFOs, buffering and lookup tables close to the logic.
• I/O-Intensive Interfaces 108 I/O pins allow the device to interface with multiple peripherals, sensors, and parallel buses on compact designs.
• Compact Surface-Mount Designs The 144-LQFP package supports space-constrained PCBs while maintaining serviceable pin access for routing.

Unique Advantages

• Balanced Logic Capacity: 5,508 logic elements deliver sufficient programmable resources for mid-sized custom digital implementations without excessive area.
• Integrated Memory: Approximately 0.22 Mbits of on-chip RAM reduces the need for external memory in buffering and small data storage tasks.
• Generous I/O Count: 108 I/O pins provide flexibility for connecting multiple interfaces and peripherals directly to the FPGA.
• Compact, Standard Package: 144-LQFP surface-mount packaging simplifies assembly and fits into many established board form factors.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant construction for standard commercial product lines.
• Well-defined Power Envelope: Core voltage support from 1.14 V to 1.26 V helps align power-supply design with common FPGA power domains.

Why Choose XC3S250E-4TQG144C?

The XC3S250E-4TQG144C positions itself as a practical, commercially graded FPGA option for engineers who need a balance of logic, embedded memory, and I/O in a compact surface-mount package. Its combination of 5,508 logic elements, roughly 0.22 Mbits of on-chip RAM, and 108 I/Os makes it suitable for mid-range digital designs where board space and integration matter.

This device is well suited to development and production environments that require predictable electrical and thermal specifications—documented core voltage range, a 0 °C to 85 °C operating window, and RoHS compliance—making it a straightforward choice for commercial embedded applications where AMD Spartan®-3E family characteristics are desired.

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