XC3S250E-4VQ100C
| Part Description |
Spartan®-3E Field Programmable Gate Array (FPGA) IC 66 221184 5508 100-TQFP |
|---|---|
| Quantity | 1,196 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 66 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 612 | Number of Logic Elements/Cells | 5508 | ||
| Number of Gates | 250000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of XC3S250E-4VQ100C – Spartan®-3E FPGA, 100-TQFP
The XC3S250E-4VQ100C is a Spartan®-3E field programmable gate array (FPGA) IC from AMD supplied in a 100-TQFP package. It provides a mid-range mix of programmable logic, on-chip memory and I/O suitable for commercial electronic designs.
With 5,508 logic elements, 612 logic blocks and approximately 0.22 Mbits of embedded RAM, this device targets applications that require moderate logic density, local buffering and a compact surface-mount package.
Key Features
- Core Logic 5,508 logic elements and 612 logic blocks for implementing custom digital logic and control functions.
- Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 bits) for data buffering, state storage and local memory needs.
- I/O 66 general-purpose I/O pins to interface with peripherals, sensors and external devices.
- Gate Count 250,000 gates providing the underlying gate-level capacity for combinational and sequential logic.
- Power Core operating voltage range of 1.14 V to 1.26 V to meet specified device power requirements.
- Package & Mounting 100-TQFP surface-mount package (supplier package: 100-VQFP 14×14) for compact board layouts.
- Operating Conditions Commercial grade operation across 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Consumer Electronics — Implement control logic, user interfaces and peripheral bridging in compact, commercial devices.
- Embedded Systems — Combine on-chip logic and memory to handle local processing, buffering and control tasks on embedded boards.
- Prototyping & Development — Use the device’s moderate logic density and accessible package for board-level proof-of-concept and early product development.
- Instrumentation & Test Equipment — Provide customizable signal routing, control and data staging where moderate gate count and RAM are sufficient.
Unique Advantages
- Balanced logic and memory: 5,508 logic elements paired with approximately 0.22 Mbits of embedded RAM enables integrated control and data buffering without external memory in many designs.
- Compact surface-mount package: 100-TQFP (100-VQFP 14×14) simplifies PCB layout for space-constrained commercial applications.
- Ample I/O for peripheral interfacing: 66 I/O pins support a variety of external sensors, interfaces and control signals.
- Low-voltage core operation: 1.14–1.26 V supply range aligns with modern low-voltage system designs.
- Commercial temperature range: Rated for 0 °C to 85 °C for typical commercial deployment environments.
- RoHS compliant: Meets environmental compliance expectations for commercial electronics manufacturing.
Why Choose XC3S250E-4VQ100C?
The XC3S250E-4VQ100C positions itself as a practical, mid-range FPGA option for commercial embedded applications that require a balanced combination of logic, on-chip memory and I/O in a compact surface-mount package. Its specification set—5,508 logic elements, 612 logic blocks, approximately 0.22 Mbits of RAM, 66 I/Os and a 100-TQFP footprint—makes it suitable for designers building consumer products, instrumentation, and development prototypes that demand programmable flexibility without high-end density.
As an AMD Spartan®-3E device, it delivers predictable capability for projects that need moderate gate counts and integrated resources, supporting faster integration and reduced external component count for many commercial designs.
Request a quote or submit a purchase inquiry to get pricing and availability for the XC3S250E-4VQ100C.

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