XC3S250E-5FTG256C

The XC3S250E-5FTG256C is a Spartan®-3E field programmable gate array (FPGA) from AMD, offered in a 256-ball fine-pitch BGA package. It provides a balanced combination of logic capacity, on-chip memory, and I/O density for commercial-grade digital designs.

Key on-chip resources include 5,508 logic elements, 612 configurable logic blocks (CLBs), approximately 0.22 Mbits of embedded memory, and 172 I/O pins, making this device suited to designs that require moderate logic integration and multiple external interfaces.

Key Features

• Core Architecture Spartan®-3E FPGA fabric with 5,508 logic elements and 612 configurable logic blocks (CLBs) for implementing custom digital logic.
• Embedded Memory Approximately 0.22 Mbits of on-chip RAM (221,184 total RAM bits) to support buffering, FIFOs, and small lookup-table storage.
• I/O Capacity 172 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Logic Density Equivalent to 250,000 gates of logic, enabling integration of multiple functions into a single device.
• Package & Mounting 256-FTBGA (17×17) surface-mount package; packaged in tray for board assembly and handling.
• Power Specified voltage supply of 1.14 V (as listed) for core operation.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Embedded Logic Integration Implement custom combinational and sequential logic where ~5,508 logic elements and CLBs meet design requirements.
• Interface Expansion Use the 172 I/O pins to bridge or adapt multiple external interfaces in compact systems.
• On-chip Data Buffering Employ approximately 0.22 Mbits of embedded RAM for temporary storage, small FIFOs, and LUT-based tables.

Unique Advantages

• Balanced Logic and Memory: 5,508 logic elements combined with 221,184 RAM bits offers a practical mix for mid-range digital designs without excessive overhead.
• High I/O Count: 172 I/O pins support integration of multiple peripherals or parallel interfaces directly on-chip.
• Compact BGA Packaging: 256-FTBGA (17×17) format enables a space-efficient board footprint for surface-mount assembly.
• Commercial-Grade Readiness: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
• Clear Power Specification: Documented voltage supply value provided for straightforward power budgeting and design integration.

Why Choose XC3S250E-5FTG256C?

The XC3S250E-5FTG256C positions itself as a practical, commercially graded FPGA option for designs that need a moderate amount of programmable logic, embedded RAM, and a substantial number of I/O pins in a compact BGA package. Its combination of 5,508 logic elements, 612 CLBs, and 172 I/Os lets engineers consolidate multiple discrete functions into a single programmable device.

This device is suitable for teams and projects aiming for cost-effective integration and predictable environmental requirements, with RoHS compliance and a defined operating temperature range supporting standard commercial deployments.

Request a quote or submit your requirements to receive pricing and availability for the XC3S250E-5FTG256C.