XC3S250E-5TQG144C

The XC3S250E-5TQG144C is a Spartan®-3E series Field Programmable Gate Array (FPGA) from AMD designed for commercial-grade applications. It provides reconfigurable digital logic with 5,508 logic elements and approximately 250,000 gates, suitable for embedded designs that require configurable I/O and on-chip memory.

With 108 user I/O pins, roughly 0.22 Mbits of embedded memory, and a compact 144-pin LQFP package, this device targets commercial embedded systems and designs where moderate logic capacity, on-chip memory, and surface-mount packaging are required.

Key Features

• Core Logic 5,508 logic elements and approximately 250,000 gates provide configurable digital resources for implementing custom logic and control functions.
• Embedded Memory Total on-chip RAM of 221,184 bits—approximately 0.22 Mbits—available for data buffering, state storage, and small lookup tables.
• General-Purpose I/O 108 user I/O pins to interface with peripherals, sensors, and external buses.
• Power Device supply voltage range from 1.14 V to 1.26 V to match system power rails and design constraints.
• Package and Mounting Surface-mount package in a 144-LQFP form factor; supplier package listed as 144-TQFP (20×20), offering a compact footprint for PCB integration.
• Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for adherence to lead-free and restricted-substance requirements.

Typical Applications

• Commercial Embedded Systems — Implements configurable logic functions and interface control in commercial electronic products operating within the 0 °C to 85 °C range.
• Prototyping and Development — Provides reprogrammable logic capacity and on-chip RAM suitable for early-stage design validation and iterative development.
• Peripheral and Interface Bridging — Use the device's 108 I/O pins to adapt, buffer, or translate between digital interfaces in space-constrained PCB layouts.

Unique Advantages

• Balanced Logic and Memory: 5,508 logic elements combined with approximately 0.22 Mbits of embedded RAM support a range of mid-density logic and small-data buffering needs.
• Flexible I/O Count: 108 user I/Os enable versatile peripheral connections without immediate need for external I/O expanders.
• Compact Surface-Mount Package: 144-LQFP / 144-TQFP (20×20) packaging simplifies placement in compact boards while supporting standard SMT assembly.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, matching common commercial product requirements.
• Regulatory Consideration: RoHS compliance helps meet environmental and manufacturing standards for lead-free assemblies.

Why Choose XC3S250E-5TQG144C?

The XC3S250E-5TQG144C delivers a practical combination of logic capacity, embedded memory, and I/O density in a commercially graded, surface-mount 144-pin package. Its specification set suits designers seeking a reprogrammable solution for commercial embedded applications that require moderate logic resources and compact PCB integration.

For teams focused on reliable, configurable digital design, this Spartan®-3E FPGA offers clear, verifiable resources—logic elements, on-chip RAM, and I/O—backed by AMD's device family support. It is appropriate for developers and procurement seeking a RoHS-compliant FPGA with defined voltage and temperature ranges.

Request a quote or submit your procurement inquiry to obtain pricing, availability, and lead-time information for the XC3S250E-5TQG144C.