XC3S400-4FG456C

The XC3S400-4FG456C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD designed for commercial embedded applications. It provides a balance of programmable logic resources, I/O capacity and on-chip memory in a compact surface-mount package.

Key architectural attributes include 8,064 logic elements, approximately 0.295 Mbits of embedded memory, 264 user I/Os and a 456-ball BGA package—delivering a practical platform for custom digital logic integration within the specified supply and temperature ranges.

Key Features

• Programmable Logic — 8,064 logic elements provide reconfigurable fabric for implementing custom digital functions and state machines.
• Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for buffering, small FIFOs and local data storage.
• I/O Capacity — 264 user I/O pins to support multiple parallel interfaces, control signals and peripheral connections.
• Gate Count — 400,000 gates as an indicator of logic complexity achievable on-device.
• Power — Core supply range of 1.14 V to 1.26 V to match system power domains and ensure predictable operation within that window.
• Package and Mounting — 456-ball BGA package (supplier device package noted as 456-FBGA, 23×23) suitable for surface-mount PCB assembly.
• Operating Conditions — Commercial-grade operation from 0 °C to 85 °C for mainstream embedded environments.
• Environmental Compliance — RoHS compliant to address common regulatory and assembly requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol handling and glue logic in general-purpose embedded products operating within commercial temperature ranges.
• Prototyping and Development — Use the FPGA’s reprogrammable fabric and on-chip memory for proof-of-concept designs and iterative hardware/software co-development.
• I/O Expansion and Interface Bridging — Leverage 264 I/Os to bridge multiple peripherals, implement parallel interfaces or expand system connectivity.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements paired with approximately 0.295 Mbits of on-chip RAM provide a compact, integrated platform for mid-density logic designs.
• Substantial I/O Count: 264 I/Os enable flexible integration with sensors, peripherals and external interfaces, reducing the need for additional interface chips.
• Compact BGA Packaging: The 456-ball BGA form factor supports high pin-count implementations in space-constrained PCB layouts with surface-mount assembly.
• Predictable Power Envelope: A defined core voltage range (1.14 V–1.26 V) facilitates straightforward power-supply design and integration.
• RoHS Compliance: Environmentally compliant construction simplifies assembly and regulatory acceptance for commercial products.

Why Choose XC3S400-4FG456C?

The XC3S400-4FG456C positions itself as a practical, commercially graded FPGA option for engineers needing a mid-density programmable solution. It combines a clear complement of logic resources, embedded RAM and a high I/O count in a compact BGA package, making it suitable for a range of commercial embedded and prototyping projects.

For design teams and procurement focused on predictable integration, this device offers a straightforward specification set—core voltage window, operating temperature range and package details—that supports reliable deployment and iterative development within commercial product lines.

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