XC3S400-4FGG320I

The XC3S400-4FGG320I is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, provided in a 320-ball BGA package. It offers a balance of programmable logic, embedded memory, and a high pin count suitable for industrial applications that require customizable digital logic and I/O integration.

Key Features

• Logic Capacity — 8064 logic elements providing flexible, user-defined digital logic resources for implementing custom functions.
• Embedded Memory — Approximately 0.295 Mbits of on-chip RAM to support buffering, small data stores, and state machines.
• I/O Count — 221 user I/O pins to accommodate multiple interfaces and peripheral connections.
• Gates and Logic Blocks — Hardware equivalent of 400,000 gates to support moderately complex designs.
• Power — Operates from a core supply range of 1.14 V to 1.26 V for defined low-voltage core operation.
• Package and Mounting — 320-ball BGA (supplier device package: 320-FBGA 19×19) optimized for surface-mount assembly.
• Temperature Grade — Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS-compliant construction supporting regulatory and manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Industrial-grade operating range and programmable logic capacity make it suitable for control, sequencing, and I/O aggregation tasks.
• Embedded System Glue Logic — Use as customizable interface and logic integration between processors, sensors, and peripherals thanks to ample I/O.
• Prototyping and Development — Hardware-configurable logic and on-chip memory allow development and validation of custom digital functions.

Unique Advantages

• Programmable Integration: Provides 8064 logic elements and embedded RAM to consolidate multiple discrete functions into a single device, reducing board complexity.
• High I/O Count: 221 user I/O pins enable direct connections to sensors, actuators, and peripheral interfaces without extensive external multiplexing.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable installations.
• BGA Packaging for Dense Designs: 320-ball FBGA (19×19) package supports compact, surface-mount integration in space-constrained systems.
• Low-Voltage Core: A defined core supply range of 1.14 V to 1.26 V supports predictable power planning for the logic fabric.
• RoHS Compliance: Designed with lead-free, RoHS-compliant materials for streamlined manufacturing and regulatory alignment.

Why Choose XC3S400-4FGG320I?

The XC3S400-4FGG320I positions itself as a versatile, industrial-grade Spartan®-3 FPGA that combines a substantial logic element count, embedded memory, and a high number of I/O in a compact BGA package. It is well suited for designers seeking a programmable solution to integrate control logic, interface bridging, and custom digital functions in industrial and embedded systems.

With clearly defined power and temperature specifications alongside RoHS compliance, this device offers predictable electrical and environmental behavior for medium-complexity designs where flexibility and integration reduce overall BOM and simplify system architecture.

Request a quote or submit your requirements to receive pricing and availability information for the XC3S400-4FGG320I. Our team can assist with lead times and order placement.