XC3S400-4FT256C

The XC3S400-4FT256C is a Spartan®-3 field programmable gate array (FPGA) from AMD. It provides a balanced combination of configurable logic, on-chip memory, and I/O capacity in a compact 256-LBGA surface-mount package for commercial-grade applications.

Key device characteristics include 896 CLBs, 8,064 logic elements, approximately 0.295 Mbits of embedded memory (294,912 total RAM bits), 173 I/O pins, and a supported supply voltage range of 1.14 V to 1.26 V. The device is RoHS compliant and rated for operation from 0 °C to 85 °C.

Key Features

• Core Logic: 896 CLBs and 8,064 logic elements provide configurable digital resources for implementing custom logic functions and finite-state machines.
• On-Chip Memory: Approximately 0.295 Mbits of embedded RAM (294,912 bits) for local data buffering, FIFOs, and state storage.
• I/O Capacity: 173 user I/O pins to support a range of external interfaces and peripheral connections.
• Gate Density: 400,000 gates of logic capacity for medium-complexity designs requiring programmable hardware resources.
• Package & Mounting: 256-LBGA (supplier device package: 256-FTBGA 17×17) in a surface-mount form factor for compact board designs.
• Power: Operates from a supply voltage range of 1.14 V to 1.26 V, enabling integration with low-voltage power domains.
• Temperature & Grade: Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Custom digital logic: Implement application-specific logic using 8,064 logic elements and 896 CLBs for glue logic, protocol handling, or control functions.
• I/O-intensive interfaces: Use 173 I/O pins to connect a variety of external peripherals and sensors within a compact footprint.
• Local buffering and state storage: Leverage approximately 0.295 Mbits of on-chip RAM for temporary data storage and buffering tasks.
• Space-constrained boards: The 256-LBGA surface-mount package supports compact PCB layouts where board area is limited.

Unique Advantages

• Balanced logic and memory: The combination of 896 CLBs, 8,064 logic elements, and ~0.295 Mbits of RAM offers a middle-ground resource set for moderate-complexity designs.
• Substantial I/O count: 173 I/O pins provide flexibility for interfacing multiple peripherals without external I/O expanders.
• Compact package: 256-LBGA (256-FTBGA 17×17) minimizes board footprint while maintaining high pin density.
• Low-voltage operation: Supported supply range of 1.14 V to 1.26 V enables integration with modern low-voltage systems.
• Commercial-grade suitability: Rated for 0 °C to 85 °C and RoHS compliant for use in standard commercial applications.

Why Choose XC3S400-4FT256C?

The XC3S400-4FT256C Spartan-3 FPGA delivers a practical mix of configurable logic, embedded memory, and I/O in a compact 256-LBGA package from AMD. It is positioned for designers who need moderate gate density, ample I/O, and on-chip RAM in a commercial-grade FPGA with RoHS compliance.

This device is well suited to projects that require scalable programmable logic resources, board-area efficiency, and straightforward integration into low-voltage designs. Its specification set supports dependable implementation of custom logic functions, interface bridging, and local buffering in commercial embedded systems.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S400-4FT256C.