XC3S400-4FTG256C

The XC3S400-4FTG256C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC by AMD. It provides a balance of on-chip logic, embedded memory, and I/O density for designs that require programmable digital logic in a surface-mount 256-LBGA package.

With 8,064 logic elements, approximately 0.295 Mbits of embedded RAM, and 173 user I/O pins, this commercial-grade device is intended for applications requiring configurable logic integration within a 1.14 V–1.26 V supply range and an operating temperature of 0 °C to 85 °C.

Key Features

• Core Logic 8,064 logic elements and approximately 400,000 equivalent gates provide the fabric for implementing custom digital functions; the device includes 896 logic array blocks.
• Embedded Memory Approximately 0.295 Mbits of on-chip RAM for buffering, state storage, and small lookup tables directly within the FPGA fabric.
• I/O Density 173 available user I/O pins to support multiple interfaces and parallel connections in a single device.
• Package and Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting for compact board integration.
• Power Supported supply voltage range from 1.14 V to 1.26 V to match system power domains and design constraints.
• Operating Conditions Commercial-grade device specified for 0 °C to 85 °C operating temperature range.
• Compliance RoHS compliant, meeting common environmental directives for lead-free assembly.

Typical Applications

• Custom Digital Logic Implement user-defined processing pipelines, combinational and sequential logic tailored to specific product requirements using the on-chip logic resources.
• Interface and Glue Logic Bridge and translate signals between subsystems, manage parallel I/O, or consolidate discrete logic functions into a single FPGA solution.
• Prototyping and Development Rapidly iterate hardware designs by reprogramming the FPGA to validate digital functions and system integration before production.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements combined with approximately 0.295 Mbits of embedded RAM enables compact implementation of moderately complex logic and buffering without external memory.
• High I/O Count: 173 user I/Os allow integration of multiple peripherals and parallel interfaces directly to the FPGA, reducing the need for external glue components.
• Compact, Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) offers a space-efficient footprint for dense PCB layouts while supporting standard surface-mount assembly.
• Predictable Power Window: Narrow supply range (1.14 V–1.26 V) supports designs that require tightly controlled core voltages.
• Environmental Compliance: RoHS compliance supports lead-free manufacturing processes and regulatory requirements.

Why Choose XC3S400-4FTG256C?

The XC3S400-4FTG256C positions itself as a capable Spartan®-3 FPGA option for designers needing a moderate amount of programmable logic, embedded memory, and I/O in a compact 256-LBGA package. Its combination of 8,064 logic elements, roughly 0.295 Mbits of on-chip RAM, and 173 I/Os makes it suitable for consolidating discrete logic, implementing custom digital functions, and developing prototypes within commercial temperature environments.

Manufactured by AMD and offered as a RoHS-compliant, surface-mount device, this FPGA provides a clear, specification-driven choice for projects where predictable supply voltage, package density, and configurable logic resources matter.

Request a quote or submit an inquiry to get pricing and availability for XC3S400-4FTG256C.