XC3S400-4PQG208C

IC FPGA 141 I/O 208QFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 294912 8064 208-BFQFP

Quantity 1,245 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O141Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XC3S400-4PQG208C – Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 294912 8064 208-BFQFP

The XC3S400-4PQG208C is an AMD Spartan®-3 family Field Programmable Gate Array offered in a 208‑pin BFQFP surface-mount package. It delivers mid-range programmable logic capacity and on-chip memory for commercial-grade embedded designs.

Built for applications that require integrated logic, I/O flexibility, and predictable power and temperature characteristics, this device combines 8,064 logic elements with approximately 0.295 Mbits of embedded RAM and 141 user I/O pins.

Key Features

  • Spartan‑3 FPGA Core Spartan‑3 family programmable logic in a commercial-grade FPGA package for configurable digital design.
  • Logic Capacity 896 configurable logic blocks delivering 8,064 logic elements to implement medium-complexity logic functions.
  • On‑Chip Memory Approximately 0.295 Mbits of embedded memory (294,912 total RAM bits) for buffering, state storage, and small data structures.
  • I/O and Gate Count 141 user I/O pins and an internal gate equivalent of 400,000 provide interface flexibility and gate-level capacity for peripheral integration.
  • Power Core voltage supply range of 1.14 V to 1.26 V to support stable device operation within specified limits.
  • Package & Mounting Surface-mount 208‑BFQFP package (supplier device package: 208‑PQFP, 28×28) for compact PCB space utilization.
  • Environmental & Grade Commercial grade device, RoHS compliant, with an operating temperature range of 0 °C to 85 °C.

Unique Advantages

  • Balanced logic and memory resources: 8,064 logic elements paired with ~0.295 Mbits of RAM reduce the need for some external components in mid-range designs.
  • Generous I/O count: 141 user I/Os enable multiple peripheral interfaces and flexible board-level integration.
  • Compact surface-mount package: 208‑BFQFP (28×28) helps conserve PCB area while maintaining adequate thermal and routing space.
  • Predictable power envelope: Narrow core voltage range (1.14 V–1.26 V) simplifies power-supply planning and validation.
  • Commercial manufacturability: RoHS compliance and a standard commercial temperature rating (0 °C–85 °C) support mainstream production environments.

Why Choose XC3S400-4PQG208C?

The XC3S400-4PQG208C positions itself as a practical, commercial-grade Spartan‑3 FPGA option for designers who need a balance of logic capacity, embedded memory, and a substantial I/O count in a compact surface-mount package. Its specification set—8,064 logic elements, approximately 0.295 Mbits of on-chip RAM, 141 I/Os, and a 208‑pin BFQFP package—makes it well suited to medium-complexity programmable logic tasks where board space and component count matter.

With RoHS compliance and a defined operating temperature range of 0 °C to 85 °C, this device supports standard commercial production and deployment scenarios while offering a clear, verifiable set of electrical and mechanical characteristics for system designers and procurement teams.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S400-4PQG208C.

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