XC3S400-4TQ144I

The XC3S400-4TQ144I is a Spartan®-3 field programmable gate array (FPGA) manufactured by AMD, supplied in a 144-lead LQFP surface-mount package. It delivers a balance of logic capacity, embedded memory and I/O in an industrial-grade component designed for temperature-sensitive deployments.

With 8,064 logic elements, approximately 0.295 Mbits of on-chip RAM and 97 user I/O pins, this device is intended for FPGA-based designs that require configurable digital logic, embedded memory and a compact package footprint while operating across an extended temperature range.

Key Features

• Core Device Type Field Programmable Gate Array (FPGA) manufactured by AMD, suited for configurable digital logic implementations.
• Logic Capacity 8,064 logic elements for implementing user-defined digital logic functions and moderate-complexity systems.
• Embedded Memory Approximately 0.295 Mbits of on-chip RAM to support buffering, state storage and small data structures without external memory.
• Input/Output 97 I/O pins to interface with peripherals, sensors and other system components.
• Gate Count 400,000 gates providing a measure of overall device complexity and integration potential.
• Power Core supply range of 1.14 V to 1.26 V to match system power-rail planning and regulator selection.
• Package & Mounting 144-LQFP (supplier device package: 144-TQFP 20×20) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade Industrial grade with an operating range of −40 °C to 100 °C for reliable operation in extended-temperature environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems — Deploy the FPGA in industrial equipment where the industrial operating range (−40 °C to 100 °C) and robust I/O support are required.
• Embedded Logic and Glue Functions — Implement custom glue logic, state machines and protocol bridging using 8,064 logic elements and on-chip RAM.
• Prototyping and Mid-Complexity Digital Designs — Use the 144-LQFP surface-mount package and 97 I/Os for compact prototypes and production boards requiring moderate logic and memory resources.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements combined with approximately 0.295 Mbits of embedded RAM enable compact implementations without immediate need for external memory.
• Extended Temperature Capability: Industrial-grade operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
• Ample I/O Count: 97 user I/O lines provide flexibility for interfacing with a variety of peripherals and system signals.
• Compact Surface-Mount Package: 144-LQFP (144-TQFP 20×20) provides a low-profile footprint suited to space-constrained PCBs and standard SMD assembly.
• Clear Power Requirements: Defined core supply range (1.14 V–1.26 V) simplifies power-supply design and regulator selection.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose XC3S400-4TQ144I?

The XC3S400-4TQ144I positions itself as a practical choice for engineers who need a moderate-density FPGA with embedded memory, flexible I/O and industrial temperature capability. Its combination of 8,064 logic elements, ~0.295 Mbits of on-chip RAM, 97 I/Os and a 144-LQFP surface-mount package delivers integration and design flexibility for embedded and industrial applications.

This device is suited to teams designing compact, robust FPGA-based systems that require clear electrical and thermal specifications; it offers a straightforward hardware foundation for applications that demand configurable logic, local memory and reliable operation across an extended temperature range.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S400-4TQ144I for your next design.