XC3S400-5FG456C

The XC3S400-5FG456C is a Spartan®-3 field programmable gate array (FPGA) IC from AMD. It integrates 8,064 logic elements and approximately 0.295 Mbits of on‑chip RAM into a high‑pin‑count BGA package, providing a compact platform for implementing custom digital logic with substantial I/O capability.

Designed for commercial‑grade applications, this device combines a 264‑pin I/O complement, a 1.14 V to 1.26 V supply range, and a 0 °C to 85 °C operating temperature window to support board‑level integration where logic density, embedded memory and I/O count matter.

Key Features

• Core and Logic 8,064 logic elements enabling implementation of complex digital functions within a single device.
• Embedded Memory Approximately 0.295 Mbits (294,912 bits) of on‑chip RAM for buffering, state storage and small data tables.
• I/O Capacity 264 available I/O pins to interface with peripherals and board‑level signals.
• Device Scale Approximately 400,000 gates of logic capacity for medium‑complexity designs.
• Power Core supply range of 1.14 V to 1.26 V for compatible power‑rail designs.
• Package & Mounting 456‑BBGA package case (supplier device package: 456‑FBGA, 23×23) with surface‑mount mounting for compact PCB layouts.
• Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Implementation of custom state machines, glue logic and FPGA prototypes using up to 8,064 logic elements and 264 I/Os.
• Embedded memory–dependent functions — Local buffering and small data storage using approximately 0.295 Mbits of on‑chip RAM to reduce external memory needs.
• High‑pin‑count board designs — Compact integration into PCB assemblies that require a 456‑pin BGA package and surface‑mount mounting.

Unique Advantages

• High logical density: 8,064 logic elements provide room for substantial digital integration within a single FPGA.
• On‑chip RAM availability: Approximately 0.295 Mbits of embedded memory supports buffering and small data structures without immediate external memory.
• Extensive I/O: 264 I/O pins enable broad interfacing to peripherals and board‑level signals.
• Compact BGA packaging: 456‑BBGA / 456‑FBGA (23×23) supports high‑density PCB layouts and surface‑mount assembly.
• Commercial temperature rating: 0 °C to 85 °C supports standard commercial applications.
• RoHS compliant: Conforms to environmental requirements for reduced hazardous substances.

Why Choose XC3S400-5FG456C?

The XC3S400-5FG456C balances logic capacity, embedded memory and I/O density in a compact surface‑mount BGA package, making it suitable for commercial designs that require moderate to substantial digital integration on the board. With a defined core voltage range and commercial temperature rating, it fits applications where predictable electrical and thermal parameters are required.

Backed by AMD, this Spartan®-3 device is a straightforward choice for engineers and procurement teams seeking a RoHS‑compliant FPGA with 8,064 logic elements, approximately 0.295 Mbits of on‑chip RAM, and 264 I/Os in a 456‑pin BGA footprint.

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