XC3S400-4TQG144C

IC FPGA 97 I/O 144TQFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 97 294912 8064 144-LQFP

Quantity 378 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XC3S400-4TQG144C – Spartan®-3 FPGA, 8,064 Logic Elements, 294,912 bits RAM, 144-LQFP

The XC3S400-4TQG144C is a Spartan®-3 field programmable gate array (FPGA) supplied in a 144-pin low-profile quad flat package. It provides a balance of configurable logic, embedded memory and I/O capacity for commercial electronic designs and development projects.

With 8,064 logic elements distributed across 896 CLBs, approximately 0.295 Mbits of on-chip RAM and 97 I/O pins, this device targets applications that require moderate gate density, flexible I/O and low-voltage core operation.

Key Features

  • Core Logic — 896 CLBs delivering 8,064 logic elements for implementing custom digital logic and state machines.
  • Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to support buffering, lookup tables and small data stores directly in the FPGA fabric.
  • I/O Capacity — 97 user I/O pins for interfacing with peripherals, sensors and external logic devices.
  • Gate Count — 400,000 gates to describe relative implementation scale for integration planning and partitioning.
  • Power — Core voltage operation in the 1.14 V to 1.26 V range to match low-voltage system designs.
  • Package & Mounting — Supplied in a 144-LQFP (supplier package: 144-TQFP, 20×20) configured for surface-mount assembly.
  • Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Environmental Compliance — RoHS-compliant construction for regulatory alignment in commercial products.

Typical Applications

  • Prototyping and Development — Used on development boards and evaluation platforms where configurable logic and moderate I/O density enable rapid design iteration.
  • Embedded Control — Implements custom control logic, state machines and peripheral management in commercial electronic devices.
  • Interface Bridging — Acts as glue logic for protocol conversion and signal aggregation between discrete peripherals and host processors.
  • Communication Prototypes — Suitable for early-stage communication and data-handling designs that require on-chip memory for buffering.

Unique Advantages

  • Balanced Logic Density: 8,064 logic elements and 896 CLBs provide a midrange capacity for integrating multiple functions without excessive board-level complexity.
  • On-Chip Memory: Approximately 0.295 Mbits of embedded RAM reduces reliance on external memory for small buffers and lookup tables.
  • Ample I/O: 97 I/O pins enable direct connections to a variety of peripherals, reducing the need for additional interface components.
  • Compact Surface-Mount Package: 144-LQFP (144-TQFP, 20×20) supports compact PCB layouts and standard assembly processes.
  • Low-Voltage Core Operation: Core supply from 1.14 V to 1.26 V aligns with low-voltage system architectures.
  • RoHS Compliance: Environmentally compliant construction simplifies regulatory considerations for commercial products.

Why Choose XC3S400-4TQG144C?

The XC3S400-4TQG144C positions itself as a practical, commercially graded FPGA option for developers and product teams needing midrange logic density, embedded memory and substantial I/O in a compact surface-mount package. Its combination of 8,064 logic elements, approximately 0.295 Mbits of on-chip RAM and 97 I/Os makes it well suited for designs that require integration of control, interfacing and buffering functions without extensive external components.

For projects focused on commercial electronics, rapid prototyping, or moderate-complexity system integration, this Spartan®-3 device offers a straightforward platform for implementation and scalability within the Spartan-3 family architecture.

Request a quote today to discuss pricing and availability for the XC3S400-4TQG144C and to begin integrating this Spartan®-3 FPGA into your next design.

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