XC3S400-4TQG144C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 97 294912 8064 144-LQFP |
|---|---|
| Quantity | 378 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 97 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 896 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 400000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of XC3S400-4TQG144C – Spartan®-3 FPGA, 8,064 Logic Elements, 294,912 bits RAM, 144-LQFP
The XC3S400-4TQG144C is a Spartan®-3 field programmable gate array (FPGA) supplied in a 144-pin low-profile quad flat package. It provides a balance of configurable logic, embedded memory and I/O capacity for commercial electronic designs and development projects.
With 8,064 logic elements distributed across 896 CLBs, approximately 0.295 Mbits of on-chip RAM and 97 I/O pins, this device targets applications that require moderate gate density, flexible I/O and low-voltage core operation.
Key Features
- Core Logic — 896 CLBs delivering 8,064 logic elements for implementing custom digital logic and state machines.
- Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM to support buffering, lookup tables and small data stores directly in the FPGA fabric.
- I/O Capacity — 97 user I/O pins for interfacing with peripherals, sensors and external logic devices.
- Gate Count — 400,000 gates to describe relative implementation scale for integration planning and partitioning.
- Power — Core voltage operation in the 1.14 V to 1.26 V range to match low-voltage system designs.
- Package & Mounting — Supplied in a 144-LQFP (supplier package: 144-TQFP, 20×20) configured for surface-mount assembly.
- Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
- Environmental Compliance — RoHS-compliant construction for regulatory alignment in commercial products.
Typical Applications
- Prototyping and Development — Used on development boards and evaluation platforms where configurable logic and moderate I/O density enable rapid design iteration.
- Embedded Control — Implements custom control logic, state machines and peripheral management in commercial electronic devices.
- Interface Bridging — Acts as glue logic for protocol conversion and signal aggregation between discrete peripherals and host processors.
- Communication Prototypes — Suitable for early-stage communication and data-handling designs that require on-chip memory for buffering.
Unique Advantages
- Balanced Logic Density: 8,064 logic elements and 896 CLBs provide a midrange capacity for integrating multiple functions without excessive board-level complexity.
- On-Chip Memory: Approximately 0.295 Mbits of embedded RAM reduces reliance on external memory for small buffers and lookup tables.
- Ample I/O: 97 I/O pins enable direct connections to a variety of peripherals, reducing the need for additional interface components.
- Compact Surface-Mount Package: 144-LQFP (144-TQFP, 20×20) supports compact PCB layouts and standard assembly processes.
- Low-Voltage Core Operation: Core supply from 1.14 V to 1.26 V aligns with low-voltage system architectures.
- RoHS Compliance: Environmentally compliant construction simplifies regulatory considerations for commercial products.
Why Choose XC3S400-4TQG144C?
The XC3S400-4TQG144C positions itself as a practical, commercially graded FPGA option for developers and product teams needing midrange logic density, embedded memory and substantial I/O in a compact surface-mount package. Its combination of 8,064 logic elements, approximately 0.295 Mbits of on-chip RAM and 97 I/Os makes it well suited for designs that require integration of control, interfacing and buffering functions without extensive external components.
For projects focused on commercial electronics, rapid prototyping, or moderate-complexity system integration, this Spartan®-3 device offers a straightforward platform for implementation and scalability within the Spartan-3 family architecture.
Request a quote today to discuss pricing and availability for the XC3S400-4TQG144C and to begin integrating this Spartan®-3 FPGA into your next design.

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