XC3S400-5FGG320C

The XC3S400-5FGG320C is a Spartan®-3 field programmable gate array (FPGA) IC designed for commercial embedded applications. It integrates 8,064 logic elements, approximately 0.295 Mbits of embedded memory, and 221 user I/O in a compact 320-BGA package to support medium-density logic and interface designs.

This device targets designs that require a balance of programmable logic capacity, on-chip memory, and high I/O count while operating within a 1.14 V to 1.26 V core supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic
  8,064 logic elements and approximately 400,000 gates provide the programmable resources needed for medium-complexity digital designs.
• Embedded Memory
  Approximately 0.295 Mbits of on-chip RAM for buffering, temporary storage, and small lookup tables.
• High I/O Count
  221 user I/O pins to support multiple interfaces, peripherals, and parallel connections.
• Package & Mounting
  320-BGA (supplier device package: 320-FBGA, 19×19) in a surface-mount form factor for dense PCB layouts.
• Power
  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulator designs.
• Operating Range & Grade
  Commercial grade operation from 0 °C to 85 °C suitable for standard commercial electronic environments.
• Compliance
  RoHS compliant for adherence to common environmental standards.

Typical Applications

• Embedded Control and Prototyping — Use the XC3S400 to implement custom control logic, state machines, and prototype hardware functions that benefit from reprogrammability.
• Interface Bridging and Glue Logic — 221 I/O pins support marrying disparate interfaces and implementing protocol translation or bus bridging on a single device.
• Data Buffering and Packet Handling — On-chip RAM combined with FPGA logic can handle buffering and simple packet processing tasks in communication endpoints.
• Peripheral and Sensor Aggregation — Aggregate multiple sensor inputs or peripheral signals and implement custom preprocessing before passing data to a host processor.

Unique Advantages

• Balanced Logic and Memory — 8,064 logic elements and approximately 0.295 Mbits of embedded RAM provide a practical balance for medium-complexity designs without external memory.
• Ample I/O for Integration — 221 user I/O pins enable extensive external connectivity, reducing the need for additional interface ICs.
• Compact BGA Package — The 320-BGA (19×19) package supports high-density board designs while remaining surface-mount compatible for standard assembly processes.
• Low-voltage Core — A focused core voltage range (1.14 V–1.26 V) simplifies power-supply planning for modern low-voltage systems.
• RoHS Compliant — Built to meet common environmental directives for easier integration into compliant products.

Why Choose XC3S400-5FGG320C?

The XC3S400-5FGG320C offers a practical mix of programmable logic density, embedded memory, and high I/O in a compact 320-BGA package, making it well suited for commercial embedded designs that need medium-complexity logic and flexible interfacing. Its core voltage range and surface-mount BGA packaging support common PCB and power-supply architectures.

This FPGA is appropriate for engineering teams and procurement sourcing parts for applications such as control logic, interface bridging, and data buffering where on-chip resources and a high pin count reduce BOM complexity and keep designs integrated and scalable.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XC3S400-5FGG320C. Our team can provide lead-time and order information to support your design schedule.