XC3S400-5FT256C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 173 294912 8064 256-LBGA |
|---|---|
| Quantity | 1,079 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 173 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 896 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 400000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of XC3S400-5FT256C – Spartan®-3 FPGA, 256-LBGA
The XC3S400-5FT256C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides a balance of on-chip logic, embedded memory and I/O resources in a 256-ball LFBGA package for commercial-grade applications.
Key device resources include 8,064 logic elements, approximately 0.295 Mbits of embedded RAM, 173 I/O pins and an internal gate equivalence of 400,000 gates, with a specified supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic 8,064 logic elements provide programmable combinational and sequential resources for custom digital logic implementations.
- Embedded Memory Approximately 0.295 Mbits of on-chip RAM to support buffering, state storage and small on-chip data structures.
- I/O and Gate Count 173 user I/O pins and an equivalent of 400,000 gates enable broad interfacing and moderate-scale logic integration.
- Power Specified supply voltage range of 1.14 V to 1.26 V for core operation.
- Package and Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting type for compact PCB layouts.
- Temperature and Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: 8,064 logic elements enable implementation of moderate-complexity digital functions without external logic.
- On-chip RAM: Approximately 0.295 Mbits of embedded memory reduces the need for external memory for small buffering and state storage.
- Generous I/O count: 173 I/O pins support multiple peripheral interfaces and board-level connectivity options.
- Compact BGA footprint: 256-LBGA (17×17) package supports dense PCB designs and surface-mount assembly.
- Low-voltage core operation: Narrow supply range (1.14 V to 1.26 V) supports stable core power delivery designs.
- Commercial availability and compliance: Commercial-grade rating and RoHS compliance simplify procurement and regulatory requirements for consumer and industrial applications within the specified temperature range.
Why Choose XC3S400-5FT256C?
The XC3S400-5FT256C offers a practical combination of logic density, embedded memory and I/O in a compact 256-LBGA package, making it suitable for designs that require moderate-scale programmable logic with on-chip resources. Its defined supply and temperature ranges and RoHS compliance provide clear electrical and environmental boundaries for system integration.
Manufactured by AMD, this Spartan®-3 FPGA variant is targeted at commercial applications where on-chip logic, memory and I/O count must be balanced with a compact surface-mount package and predictable operating conditions.
Request a quote to obtain pricing and availability for the XC3S400-5FT256C or to submit your procurement requirements.

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