XC3S400-5FT256C

IC FPGA 173 I/O 256FTBGA
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 173 294912 8064 256-LBGA

Quantity 1,079 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O173Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XC3S400-5FT256C – Spartan®-3 FPGA, 256-LBGA

The XC3S400-5FT256C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides a balance of on-chip logic, embedded memory and I/O resources in a 256-ball LFBGA package for commercial-grade applications.

Key device resources include 8,064 logic elements, approximately 0.295 Mbits of embedded RAM, 173 I/O pins and an internal gate equivalence of 400,000 gates, with a specified supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Logic 8,064 logic elements provide programmable combinational and sequential resources for custom digital logic implementations.
  • Embedded Memory Approximately 0.295 Mbits of on-chip RAM to support buffering, state storage and small on-chip data structures.
  • I/O and Gate Count 173 user I/O pins and an equivalent of 400,000 gates enable broad interfacing and moderate-scale logic integration.
  • Power Specified supply voltage range of 1.14 V to 1.26 V for core operation.
  • Package and Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting type for compact PCB layouts.
  • Temperature and Grade Commercial-grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: 8,064 logic elements enable implementation of moderate-complexity digital functions without external logic.
  • On-chip RAM: Approximately 0.295 Mbits of embedded memory reduces the need for external memory for small buffering and state storage.
  • Generous I/O count: 173 I/O pins support multiple peripheral interfaces and board-level connectivity options.
  • Compact BGA footprint: 256-LBGA (17×17) package supports dense PCB designs and surface-mount assembly.
  • Low-voltage core operation: Narrow supply range (1.14 V to 1.26 V) supports stable core power delivery designs.
  • Commercial availability and compliance: Commercial-grade rating and RoHS compliance simplify procurement and regulatory requirements for consumer and industrial applications within the specified temperature range.

Why Choose XC3S400-5FT256C?

The XC3S400-5FT256C offers a practical combination of logic density, embedded memory and I/O in a compact 256-LBGA package, making it suitable for designs that require moderate-scale programmable logic with on-chip resources. Its defined supply and temperature ranges and RoHS compliance provide clear electrical and environmental boundaries for system integration.

Manufactured by AMD, this Spartan®-3 FPGA variant is targeted at commercial applications where on-chip logic, memory and I/O count must be balanced with a compact surface-mount package and predictable operating conditions.

Request a quote to obtain pricing and availability for the XC3S400-5FT256C or to submit your procurement requirements.

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