XC3S400-5PQG208C

The XC3S400-5PQG208C is a Spartan®-3 Field Programmable Gate Array from AMD, provided in a 208-BFQFP (208-PQFP 28×28) package for surface-mount assembly. It delivers 8,064 logic elements and approximately 294,912 bits of on-chip RAM with 141 user I/O pins, targeting commercial electronic designs that require flexible digital logic integration.

With a nominal core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, this device is specified for commercial-grade applications where moderate performance and integration count are required.

Key Features

• Core Logic 8,064 logic elements (LEs) providing programmable fabric for custom digital designs and logic consolidation.
• Embedded Memory Approximately 294,912 bits of on-chip RAM to support lookup tables, FIFOs, and buffering within the FPGA fabric.
• I/O Count 141 user I/O pins suited for interfacing with peripherals, external memory, and control signals.
• Gate Count 400,000 gates indicating the overall integration scale available on the device.
• Power Supply Core voltage range of 1.14 V to 1.26 V to match system power architectures that support Spartan®-3 devices.
• Package & Mounting 208-BFQFP (supplier package 208-PQFP, 28×28) in a surface-mount form factor for compact PCB implementations.
• Temperature Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• RoHS Compliance Device is RoHS compliant to meet common environmental requirements.

Typical Applications

• Commercial Embedded Systems Use the FPGA’s 8,064 logic elements and 141 I/O to implement custom control logic, protocol bridging, or peripheral aggregation in commercial products.
• Digital Signal Glue Logic Employ on-chip RAM and programmable fabric to implement buffers, state machines, and interface translation between digital subsystems.
• Prototyping and Development Platforms Suitable for evaluation boards and development platforms that require reprogrammable logic and a mid-range integration density.

Unique Advantages

• Balanced Logic and Memory The combination of 8,064 logic elements with approximately 294,912 bits of embedded RAM supports designs that need both combinational logic and local storage.
• Generous I/O Count 141 user I/O pins enable multiple external interfaces without requiring additional multiplexing components, simplifying board-level design.
• Compact Surface-Mount Package The 208-BFQFP (28×28) package provides a high pin-count solution in a footprint compatible with standard surface-mount assembly processes.
• Commercial Temperature Suitability Rated for 0 °C to 85 °C operation, matching typical commercial application environments and deployment scenarios.
• Environmentally Compliant RoHS compliance supports regulatory and corporate environmental requirements.

Why Choose XC3S400-5PQG208C?

The XC3S400-5PQG208C positions itself as a mid-range Spartan®-3 FPGA delivering a practical balance of logic resources, embedded memory, and I/O capacity in a compact 208-BFQFP surface-mount package. It is well suited to commercial design teams looking for a reprogrammable solution to consolidate glue logic, implement protocol interfaces, or prototype digital systems.

With a defined supply voltage range and commercial temperature rating, this device offers predictable integration into standard power and thermal designs while maintaining RoHS compliance for environmental considerations.

Request a quote or submit a purchase inquiry to get pricing and availability for the XC3S400-5PQG208C. Provide your quantity and delivery requirements to receive a tailored response.