XC3S4000-4FG676I

The XC3S4000-4FG676I is an AMD Spartan®-3 field programmable gate array (FPGA) delivered in a 676-ball BGA package. It combines substantial logic capacity with a large I/O count and embedded memory to support complex digital designs.

With 62,208 logic elements, approximately 1.77 Mbits of on-chip RAM and 489 I/O, this industrial-grade FPGA targets designs that require high integration, broad connectivity and operation across an extended temperature range.

Key Features

• Core Architecture Spartan®-3 FPGA architecture provided in the XC3S4000-4FG676I package for programmable logic implementations.
• Logic Capacity 62,208 logic elements (cells) supporting large-scale digital designs and custom hardware functions.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• Gate Count Approximately 4,000,000 gates for complex combinational and sequential logic.
• I/O & Connectivity 489 user I/O pins to accommodate dense board-level interfaces and peripheral connections.
• Package & Mounting 676-ball FBGA package (27 × 27 mm) in a surface-mount form factor for compact, high-density board integration.
• Power Core voltage supply range from 1.14 V to 1.26 V for the device core.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance RoHS compliant for environmental and assembly considerations.

Typical Applications

• Industrial Control The industrial temperature rating (−40 °C to 100 °C) and broad I/O count make this FPGA suitable for control systems and factory automation interfaces.
• High-density Digital Logic With 62,208 logic elements and approximately 1.77 Mbits of embedded memory, the device supports complex custom logic and data-path implementations.
• I/O-intensive Systems 489 I/O pins in a compact 676-FBGA package enable dense connectivity for communication and peripheral-heavy designs.
• Embedded Processing and Acceleration The combination of gate density and on-chip RAM allows implementation of hardware-accelerated functions and embedded processing blocks.

Unique Advantages

• High Integration: Large logic element count and substantial on-chip RAM reduce the need for external components, simplifying system design.
• Extensive I/O Availability: 489 I/O pins provide flexibility for interfacing multiple peripherals, buses and signals without extensive board routing workarounds.
• Industrial Reliability: Rated for operation from −40 °C to 100 °C to support deployments in demanding environments.
• Compact, High-density Package: 676-FBGA (27 × 27 mm) surface-mount package supports compact PCB layouts while maintaining high pin count.
• Controlled Core Voltage: Narrow core supply range (1.14 V to 1.26 V) for predictable power management and integration with system power rails.
• Environmental Compliance: RoHS compliance supports eco-conscious manufacturing and regulatory requirements.

Why Choose XC3S4000-4FG676I?

The XC3S4000-4FG676I positions itself as a high-capacity, industrial-grade FPGA option for designs that require substantial programmable logic, abundant I/O and embedded memory in a compact BGA package. Its combination of approximately 62,208 logic elements, roughly 1.77 Mbits of RAM and 489 I/O pins delivers integration and flexibility for complex digital systems.

This part is well suited for engineering teams developing industrial controls, I/O-dense systems or custom hardware accelerators who need predictable operating conditions, RoHS compliance and a compact form factor for board-level implementation.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S4000-4FG676I Spartan®-3 FPGA.