XC3S4000-4FG900I

The XC3S4000-4FG900I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC designed for industrial applications requiring substantial programmable logic, on-chip memory, and a high-count I/O interface. With 62,208 logic elements and approximately 1.77 Mbits of embedded memory, this device delivers a balanced combination of logic capacity and embedded RAM in a 900-ball BGA package suited for surface-mount assembly.

Key Features

• Logic Capacity — 62,208 logic elements providing support for complex custom logic implementations and substantial gate-level integration (4,000,000 gates).
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory dependence.
• I/O Resources — 633 user I/O pins to accommodate extensive peripheral, sensor, and bus interfacing requirements.
• Power Supply Range — Core voltage range of 1.14 V to 1.26 V to match system power-rail requirements and ensure consistent operation within specified limits.
• Package & Mounting — 900-BBGA package (supplier device package: 900-FBGA, 31 × 31) optimized for surface-mount PCB assembly in space-constrained designs.
• Operating Environment — Industrial-grade operation from -40 °C to 100 °C for deployment in demanding temperature conditions.
• Regulatory — RoHS compliant, supporting regulatory requirements for materials and manufacturing.

Typical Applications

• Industrial Control & Automation — Implement programmable controllers, logic sequencing, and I/O aggregation for factory and process automation systems within industrial temperature ranges.
• Communications Infrastructure — Support custom protocol engines and parallel I/O interfaces for networking or backplane applications that require significant logic and memory resources.
• Data Acquisition & Signal Processing — Perform local data buffering and preprocessing using the device’s embedded RAM and extensive logic for sensor front-ends and acquisition systems.
• High-Density I/O Bridging — Act as a customizable bridge between multiple subsystems or buses where high I/O count and programmable logic are needed.

Unique Advantages

• Substantial Logic Resources: 62,208 logic elements and ~4 million gates enable implementation of complex custom logic without immediate reliance on multiple devices.
• On-Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces the need for external memory for many buffering and local storage tasks.
• Extensive I/O Count: 633 user I/Os provide flexibility for interfacing to sensors, buses, and peripherals, simplifying board-level connectivity.
• Industrial Temperature Rating: Rated for -40 °C to 100 °C operation, supporting deployment in challenging thermal environments.
• Compact BGA Package: 900-ball BGA (900-FBGA, 31 × 31) supports high-density PCB designs while maintaining a surface-mount form factor.
• RoHS Compliance: Conforms to RoHS requirements to support environmental and regulatory objectives.

Why Choose XC3S4000-4FG900I?

The XC3S4000-4FG900I combines a high logic-element count, significant embedded memory, and a large number of I/Os in a compact 900-ball BGA package, making it well suited for industrial designs that require dense programmable logic and robust operating temperature capability. Its specified voltage range and RoHS compliance support integration into regulated production environments.

This FPGA is appropriate for engineers and procurement teams building systems that demand scalable logic capacity, flexible interfacing, and durable operation across wide temperature ranges.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead-time information for the XC3S4000-4FG900I.