XC3S400-5TQG144C

IC FPGA 97 I/O 144TQFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 97 294912 8064 144-LQFP

Quantity 1,308 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of XC3S400-5TQG144C – Spartan®-3 FPGA, 8,064 logic elements, ~0.295 Mbits RAM, 97 I/O, 144-LQFP

The XC3S400-5TQG144C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC providing 8,064 logic elements and approximately 0.295 Mbits of embedded memory. It combines a substantial gate count and a broad I/O complement in a compact 144-LQFP surface-mount package for commercial-temperature applications.

Key Features

  • Core Logic  8,064 logic elements supporting up to 400,000 gates for implementing custom digital logic and state machines.
  • Embedded Memory  Approximately 294,912 bits (≈0.295 Mbits) of on-chip RAM for buffering, FIFOs, and small lookup tables.
  • I/O Resources  97 user I/O pins to support a range of external interfaces and board-level connectivity requirements.
  • Package & Mounting  144-LQFP package (supplier device package listed as 144-TQFP 20×20) designed for surface-mount assembly.
  • Power  Specified core supply range of 1.14 V to 1.26 V to meet system power requirements.
  • Temperature & Grade  Commercial operating temperature range of 0 °C to 85 °C; classified as Commercial grade.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing process compatibility.

Unique Advantages

  • Substantial logic density: 8,064 logic elements and 400,000 gates provide the capacity to implement complex control and processing functions on-chip.
  • On-chip RAM for local buffering: Nearly 0.295 Mbits of embedded memory reduces dependence on external RAM for small to moderate buffering tasks.
  • Ample I/O count: 97 I/O pins facilitate integration with multiple peripheral devices and board-level signals without immediate need for external expanders.
  • Compact surface-mount package: 144-LQFP / 144-TQFP (20×20) footprint supports streamlined PCB layout and automated assembly processes.
  • Low-voltage core operation: Narrow core supply window (1.14 V–1.26 V) enables predictable power planning in designs with constrained supply rails.
  • Regulatory readiness: RoHS compliance helps meet environmental requirements for commercial products.

Why Choose XC3S400-5TQG144C?

The XC3S400-5TQG144C positions itself as a balanced commercial-grade FPGA option, delivering a combination of logic capacity, embedded memory, and a high I/O count in a compact 144-LQFP surface-mount package. Its defined core voltage range and RoHS compliance make it suitable for engineered solutions that require predictable power budgeting and environmental conformity.

This part is appropriate for design teams seeking on-chip resources—logic, RAM, and I/O—within a commercial temperature window and a standard surface-mount package footprint. Its specifications support integration into a variety of programmable-logic designs where moderate memory and substantial logic elements are required.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time information for the XC3S400-5TQG144C.

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